Patents by Inventor Edward C. Priest

Edward C. Priest has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11428733
    Abstract: Some examples described herein provide for an on-die virtual probe in an integrated circuit structure for measurement of voltages. In an example, an integrated circuit comprises a voltage-controlled frequency oscillator circuitry and a processor circuitry. The voltage-controlled frequency oscillator circuitry comprises a plurality of circuitry components and is configured to generate a signal having a frequency related to a supply voltage. The voltage-controlled frequency oscillator circuitry is disposed at a location of the integrated circuit proximal to the supply voltage being monitored. The processor circuitry is configured to identify a relationship between the frequency of the signal and the supply voltage. The processor circuitry is also configured to determine a value of the supply voltage associated with the signal based on the identified relationship. The processor circuitry further monitors on-die transient voltages at the location of the integrated circuit based on the value of the supply voltage.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: August 30, 2022
    Assignee: XILINX, INC.
    Inventors: Yanran Chen, Edward C. Priest, Martin L. Voogel, Hing Yan To
  • Patent number: 10069596
    Abstract: In an example of this disclosure, a method may include receiving, by a bit error location analyzer, a split information signal at a second data rate derived from an information signal at a first data rate. In this example, the second data rate is less than the first data rate, and the bit error location analyzer may be incapable of performing error analysis at the first data rate The method may include performing error analysis, by the bit error location analyzer, on information represented by the split information signal. In some examples, performing error analysis may include comparing the information represented by the split information signal to an information seed to determine a plurality of bit error locations in the information represented by the split information signal relative to the information seed.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: September 4, 2018
    Assignee: Juniper Networks, Inc.
    Inventors: David P. Chengson, Granthana Kattehalli Rangaswamy, David James Ofelt, Edward C. Priest, Bhavesh Patel
  • Patent number: 5999437
    Abstract: A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon.
    Type: Grant
    Filed: January 27, 1997
    Date of Patent: December 7, 1999
    Assignee: Silicon Graphics, Inc.
    Inventors: David P. Chengson, William L. Schmidt, Unmesh Agarwala, Alan D. Foster, Edward C. Priest, John C. Manton, Ali Mira
  • Patent number: 5867419
    Abstract: A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon.
    Type: Grant
    Filed: July 29, 1997
    Date of Patent: February 2, 1999
    Assignee: Silicon Graphics, Inc.
    Inventors: David P. Chengson, William L. Schmidt, Unmesh Agarwala, Alan D. Foster, Edward C. Priest, John C. Manton, Ali Mira
  • Patent number: 5790612
    Abstract: The present invention incorporates a variable delay circuit to add delay to a clock signal. In a preferred embodiment of the present invention, the delay is determined and fixed by a circuit employing the concept of a lock-and-leave circuit. This has the effect of fine tuning the delay determined by the lock-and-leave circuit. Mode bits allow a user to control the rate at which fine tuning occurs. Three update rates are provided in a preferred embodiment of the present invention. They are slow, medium, and fast.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: August 4, 1998
    Assignee: Silicon Graphics, Inc.
    Inventors: David P. Chengson, Hansel A. Collins, Edward C. Priest, Scott W. Alvarez
  • Patent number: 5710733
    Abstract: A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon.
    Type: Grant
    Filed: January 22, 1996
    Date of Patent: January 20, 1998
    Assignee: Silicon Graphics, Inc.
    Inventors: David P. Chengson, William L. Schmidt, Unmesh Agarwala, Alan D. Foster, Edward C. Priest, John C. Manton, Ali Mira
  • Patent number: 5625831
    Abstract: A unified parallel processing architecture connects together an extendible number of clusters of multiple numbers of processors to create a high performance parallel processing computer system. Multiple processors are grouped together into four or more physically separable clusters, each cluster having a common cluster shared memory that is symmetrically accessible by all of the processors in that cluster; however, only some of the clusters are adjacently interconnected. Clusters are adjacently interconnected to form a floating shared memory if certain memory access conditions relating to relative memory latency and relative data locality can create an effective shared memory parallel programming environment. A shared memory model can be used with programs that can be executed in the cluster shared memory of a single cluster, or in the floating shared memory that is defined across an extended shared memory space comprised of the cluster shared memories of any set of adjacently interconnected clusters.
    Type: Grant
    Filed: October 31, 1994
    Date of Patent: April 29, 1997
    Assignee: Cray Research, Inc.
    Inventors: Edward C. Priest, John M. Wastlick
  • Patent number: 5442475
    Abstract: An optical clock distribution method and apparatus is disclosed that minimizes clock skew in the distribution of clock signals to logic assemblies in a computer system. The logic assemblies convert the optical signals into equivalent electrical signals.
    Type: Grant
    Filed: April 21, 1994
    Date of Patent: August 15, 1995
    Assignee: Cray Research, Inc.
    Inventors: Marvin D. Bausman, Steven S. Chen, Edward C. Priest, Douglas C. Paffel
  • Patent number: 5428803
    Abstract: A unified parallel processing architecture connects together an extendible number of clusters of multiple numbers of processors to create a high performance parallel processing computer system. Multiple processors are grouped together into four or more physically separable clusters, each cluster having a common cluster shared memory that is symmetrically accessible by all of the processors in that cluster; however, only some of the clusters are adjacently interconnected. Clusters are adjacently interconnected to form a floating shared memory if certain memory access conditions relating to relative memory latency and relative data locality can create an effective shared memory parallel programming environment. A shared memory model can be used with programs that can be executed in the cluster shared memory of a single cluster, or in the floating shared memory that is defined across an extended shared memory space comprised of the cluster shared memories of any set of adjacently interconnected clusters.
    Type: Grant
    Filed: July 10, 1992
    Date of Patent: June 27, 1995
    Assignee: Cray Research, Inc.
    Inventors: Steve S. Chen, Douglas R. Beard, George A. Spix, Edward C. Priest, John M. Wastlick, James M. VanDyke
  • Patent number: 5355397
    Abstract: Utilization circuits, such as logic chip circuits, are prevented from receiving the initial one or more pulses of a train of clock pulses produced after the master system clock is started, while the pulses of that train occurring thereafter are coupled to the utilization circuit. This prevents the skew usually present between the initial pulses of the train relative to the subsequent train pulses from adversely effecting operation of the utilization circuits. This clock swallowing preferably blocks a certain predetermined number of initial clock pulses from reaching the rest of the circuitry, although the system is adaptable to allow preselection of the number of such swallowed pulses.
    Type: Grant
    Filed: September 24, 1992
    Date of Patent: October 11, 1994
    Assignee: Cray Research, Inc.
    Inventors: David A. Hanson, Edward C. Priest
  • Patent number: 5293626
    Abstract: Clock pulses from a master oscillator are distributed in a multiprocessor computer system so that they arrive at a large number of utilization points located in operating clusters of modules within extremely tight time tolerances of each other. The delays associated with each component, electrical or optical connection, cable or the like are determined by direct measurement or by using known standard characteristics. A time delay budget for each complete clock pulse path from the point of initial divergence from the master clock source to the final chip delivery point is logged and summed. Components capable of introducing predetermined amounts of time delay are incorporated in some or all clock pulse paths. These components are adjusted so as to balance out the differences determined from the clock path budgets. The clock paths are implemented in electrical components either alone or in combination with optical components, or in substantially all optical configurations.
    Type: Grant
    Filed: June 8, 1990
    Date of Patent: March 8, 1994
    Assignee: Cray Research, Inc.
    Inventors: Edward C. Priest, Steven C. Barber, Ken Shintaku, David A. Hanson, Dan L. Massopust
  • Patent number: 5251097
    Abstract: The present invention includes methods and apparatus for creating a packaging architecture for a highly parallel multiprocessor system. The packaging architecture of the present invention can provide for distribution of power, cooling and interconnections at all levels of components in a highly parallel multiprocessor system, while maximizing the number of circuits per unit time within certain operational constraints of such a multiprocessor system.
    Type: Grant
    Filed: June 11, 1990
    Date of Patent: October 5, 1993
    Assignee: Supercomputer Systems Limited Partnership
    Inventors: Frederick J. Simmons, Steve S. Chen, Greg W. Pautsch, Michael H. Rabska, Dennis F. Girling, Douglas C. Paffel, Dan L. Massopust, Lisa Heid, Felix R. Lesmerises, Christopher J. Sperry, Edward C. Priest