Patents by Inventor Edward C. Skorupski

Edward C. Skorupski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Formation of an embedded capacitor plane using a thin dielectric
    Patent number: 6657849
    Abstract: A capacitor, which has a pair of conductive foils each having a dielectric layer on its surface, wherein the dielectric layers are attached to one another. In one process for its production, a capacitor is formed by applying a first dielectric layer onto a surface of a first conductive foil; applying a second dielectric layer onto a surface of a second conductive foil; and then attaching the first and second dielectric layers to one another. The resulting capacitor exhibits excellent void resistance.
    Type: Grant
    Filed: August 24, 2000
    Date of Patent: December 2, 2003
    Assignee: Oak-Mitsui, Inc.
    Inventors: John A. Andresakis, Edward C. Skorupski, Scott Zimmerman, Gordon Smith
  • Substrate adhesion enhancement to film
    Patent number: 6629348
    Abstract: The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly, the present invention pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing high-density circuits. A metal foil is laminated to an etched surface of a polyimide substrate having a polyimide film thereon. Etching the substrate surface allows for strong adhesion of a pure polyimide film to the substrate.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: October 7, 2003
    Assignee: Oak-Mitsui, Inc.
    Inventors: Edward C. Skorupski, Jeffrey T. Gray, John A. Andresakis, Wendy Herrick
  • Substrate adhesion enhancement to film
    Publication number: 20020162218
    Abstract: The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly, the present invention pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing high-density circuits. A metal foil is laminated to an etched surface of a polyimide substrate having a polyimide film thereon. Etching the substrate surface allows for strong adhesion of a pure polyimide film to the substrate.
    Type: Application
    Filed: May 1, 2001
    Publication date: November 7, 2002
    Applicant: OAK-MITSUI, Inc.
    Inventors: Edward C. Skorupski, Jeffrey T. Gray, John A. Andresakis, Wendy Herrick
  • Polyimide adhesion enhancement to polyimide film
    Publication number: 20020130103
    Abstract: The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly, the present invention pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing high-density circuits. A metal foil coated with a polyimide film is laminated onto an etched surface of a polyimide substrate. Etching the substrate surface allows for strong adhesion of a pure polyimide film to the substrate.
    Type: Application
    Filed: March 15, 2001
    Publication date: September 19, 2002
    Inventors: Scott M. Zimmerman, Edward C. Skorupski, Gordon C. Smith