Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for processing data about a medical encounter using neural networks. One of the methods includes obtaining features for a medical encounter associated with the patient, each feature representing a corresponding health event associated with the medical encounter and each of the plurality of features belonging to a vocabulary of possible features that each represent a different health event; and generating respective final embeddings for each of the features for the medical encounter by applying a sequence of one or more self-attention blocks to the features for the medical encounter, wherein each of the one or more self-attention blocks receives a respective block input for each of the features and applies self-attention over the block inputs to generate a respective block output for each of the features.

Abstract: A subassembly for an electrical component includes: a first plate including: a wall, stepped walls extending from opposite sides of the wall, flange elements extending outwardly from the stepped walls, each flange element defining an engagement slot; a first heatsink positioned on the wall between the stepped walls; a second heatsink; a power module between the first heatsink and the second heatsink; and a second plate including: a plate wall extending across the second heatsink, transition walls extending from opposite sides of the plate wall, and prongs extending from the transition walls toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heatsink, wherein the prongs are aligned with and configured to engage the engagement slots.

Abstract: A system for an electric vehicle includes: a first heat sink including a first mounting hole extending through the first heat sink; a second heat sink positioned adjacent to the first heat sink in an axial direction; and a spacer between the first heat sink and the second heat sink to set a distance between the first heat sink and the second heat sink, the spacer including: a flange that is coupled to both the first heat sink and the second heat sink, the flange having a thickness in the axial direction, and a protrusion extending away from the flange, the protrusion received by the first mounting hole of the first heat sink.

Abstract: A system for an electric vehicle includes: a first heat sink including a cooling pipe extending in an axial direction; a housing including a port to receive the cooling pipe, the port including an alignment feature; and a second heat sink between the first heat sink and the housing, the second heat sink including an opening to cooperate with the alignment feature of the port to align the second heat sink with the housing.

Abstract: A heat sink system includes: a container including a cavity; a housing connecting to the container to cover the cavity, wherein one or more of the container or the housing includes an inlet port, and one or more of the container or the housing includes an outlet port; and a cooling module in the cavity between the container and the housing, the cooling module in a flow of coolant from the inlet port to the outlet port, wherein the cooling module includes: first cooling fins with a first cooling fin geometry, and second cooling fins with a second cooling fin geometry, wherein the first cooling fins are upstream of the second cooling fins along the flow of coolant from the inlet port to the outlet port.

Abstract: A system includes a power module, wherein the power module includes an interlocking feature on a first surface of the power module; and at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.

Abstract: A subassembly for an electrical component includes: a first plate including: a wall, stepped walls extending from opposite sides of the wall, flange elements extending outwardly from the stepped walls, each flange element defining an engagement slot; a first heatsink positioned on the wall between the stepped walls; a second heatsink; a power module between the first heatsink and the second heatsink; and a second plate including: a plate wall extending across the second heatsink, transition walls extending from opposite sides of the plate wall, and prongs extending from the transition walls toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heatsink, wherein the prongs are aligned with and configured to engage the engagement slots.

Abstract: A system includes a power module, wherein the power module includes a first interlocking feature on a first surface of the power module; and at least one heat sink, wherein the at least one heat sink includes a second interlocking feature on a surface of the at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module for an inverter for an electric vehicle, the power module comprising: a first substrate having an outer layer and an inner layer; a first electrically conductive spacer coupled to the inner layer of the first substrate; a first semiconductor die coupled to the first electrically conductive spacer; and a second substrate having an outer layer and an inner layer, the first semiconductor die coupled to the inner layer of the second substrate.

Abstract: A cooling manifold assembly that is configured to cool power modules in a vehicle includes a planar cooling chamber with a supply inlet and a return outlet; a supply chamber in an upper portion of the planar cooling chamber that is in fluid communication with the supply inlet and configured to couple to adjacent planar cooling chambers at the supply inlet; a return chamber in a lower portion of the planar cooling chamber that is in fluid communication with the return outlet and configured to couple to adjacent planar cooling chambers at the return outlet; and an opening at a distal end of the planar cooling chamber fluidly connecting the supply chamber with the return chamber.

Abstract: A device (1) comprises: a cylindrical shell (4); a first spring (5) encased inside the cylindrical shell (4); a second spring (6) encased inside the cylindrical shell (4); a separator (13) in the cylindrical shell (4) separating the first and second springs (5, 6); a first end plate (12) on a first side (13a) of the separator (13) and a second end plate (11) on a second side (13b) of the separator (13); a first rod (2) and a second rod (3) passing openings (20a, 20b) provided at each end of the cylindrical shell (4), with the first rod (2) connected to the first end plate (12) and the second rod (3) connected to the second end plate (11); and a spacer (14) inserted between the first end plate (12) and the first spring (5).

Abstract: A cooling manifold assembly that is configured to cool power modules in a vehicle includes a planar cooling chamber with a supply inlet and a return outlet; a supply chamber in an upper portion of the planar cooling chamber that is in fluid communication with the supply inlet and configured to couple to adjacent planar cooling chambers at the supply inlet; a return chamber in a lower portion of the planar cooling chamber that is in fluid communication with the return outlet and configured to couple to adjacent planar cooling chambers at the return outlet; and an opening at a distal end of the planar cooling chamber fluidly connecting the supply chamber with the return chamber.

Abstract: A device (1) comprises: a cylindrical shell (4); a first spring (5) encased inside the cylindrical shell (4); a second spring (6) encased inside the cylindrical shell (4); a separator (13) in the cylindrical shell (4) separating the first and second springs (5, 6); a first end plate (12) on a first side (13a) of the separator (13) and a second end plate (11) on a second side (13b) of the separator (13); a first rod (2) and a second rod (3) passing openings (20a, 20b) provided at each end of the cylindrical shell (4), with the first rod (2) connected to the first end plate (12) and the second rod (3) connected to the second end plate (11); and a spacer (14) inserted between the first end plate (12) and the first spring (5).

Abstract: This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.

Abstract: A cooling device for an electric component may include a manifold with a coolant section having a coolant inlet trough and a coolant outlet trough. The device may further include a fluid turbulator having a turbulator plate with turbulator fins extending upwardly therefrom, and turbulator inlet openings and outlet openings through the turbulator plate, and a turbulator carrier surrounding the turbulator plate. The fluid turbulator may be installed between the coolant section and the electric component so that a heat exchange reservoir is defined by bottom surface of the electric component, the turbulator plate top surface and the turbulator carrier. Coolant from a coolant source may flow into the coolant inlet trough, through the turbulator inlet opening into the heat exchange reservoir, and out of the heat exchange reservoir through the turbulator outlet opening into the coolant outlet trough to remove heat from the electric component.

Abstract: A cooling device configured to be connected to an object having a surface is disclosed. The cooling device may include a manifold configured to be deposited directly onto the surface of the object, wherein the manifold includes a first side configured to be deposited directly onto the surface of the object, a cavity formed in the first side, an inlet channel fluidly connected to the cavity, and an outlet channel fluidly connected to the cavity. The cooling device may further include a turbulator configured to be deposited directly onto the surface of the object, wherein the turbulator extends into the cavity of the manifold.

Abstract: A cooling device configured to be connected to an object having a surface is disclosed. The cooling device may include a manifold configured to be deposited directly onto the surface of the object, wherein the manifold includes a first side configured to be deposited directly onto the surface of the object, a cavity formed in the first side, an inlet channel fluidly connected to the cavity, and an outlet channel fluidly connected to the cavity. The cooling device may further include a turbulator configured to be deposited directly onto the surface of the object, wherein the turbulator extends into the cavity of the manifold.

Abstract: This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.

Abstract: A cooling module for an electrical component is provided. The cooling module includes a housing defining an interior space for receiving a coolant. A flow directing member is arranged in the interior space of the housing. The flow directing member includes a plate that is divided into a plurality of discrete cells arranged parallel to each other with adjacent cells being separated from each other by a dividing wall. Each cell has an inlet opening in the plate through which coolant is directed onto a surface of the plate and an outlet opening in the plate through which coolant is directed off the surface of the plate. Each cell has a plurality of fins arranged on the surface of the plate in a herringbone pattern.

Abstract: An edible anhydrous chocolate-based fat system is provided, having a significant granulated sugar component. This provides an unusual mouth sense, and allows for significantly different organoleptic properties of the chocolate-based fat system—which otherwise emulates chocolate. The chocolate may be light or dark, or white chocolate. An additional sweet flavor may be added to the chocolate-based fat system, allowing for a faster release of the additional flavor, by infusing or saturating the granulated sugar component of the fat system with the additional flavor. Typically, the granulated sugar component is saturated with an essential oil of a chosen flavor. Apart from the granulated sugar component, the remaining ingredients of the chocolate-based fat system are conched in the usual manner in keeping with chocolate production techniques. A process for production of the edible anhydrous chocolate-based fat system is discussed, and typical machinery for carrying out that process is shown.