Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module for an inverter for an electric vehicle, the power module comprising: a first substrate having an outer layer and an inner layer; a first electrically conductive spacer coupled to the inner layer of the first substrate; a first semiconductor die coupled to the first electrically conductive spacer; and a second substrate having an outer layer and an inner layer, the first semiconductor die coupled to the inner layer of the second substrate.

Abstract: A head-mounted display may include a display system and an optical system in a housing. The display system may have displays that produce images. Positioners may be used to move the displays relative to the eye positions of a user's eyes. An adjustable optical system may include tunable lenses such as tunable cylindrical liquid crystal lenses. The displays may be viewed through the lenses when the user's eyes are at the eye positions. A sensor may be incorporated into the head-mounted display to measure refractive errors in the user's eyes. The sensor may include waveguides and volume holograms, and a camera for gathering light that has reflected from the retinas of the user's eyes. Viewing comfort may be enhanced by adjusting display positions relative to the eye positions and/or by adjusting lens settings based on the content being presented on the display and/or measured refractive errors.

Abstract: A system includes a power module, wherein the power module includes a first interlocking feature on a first surface of the power module; and at least one heat sink, wherein the at least one heat sink includes a second interlocking feature on a surface of the at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.

Abstract: A system includes a power module, wherein the power module includes an interlocking feature on a first surface of the power module; and at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.

Abstract: A subassembly for an electrical component includes: a first plate including: a wall, stepped walls extending from opposite sides of the wall, flange elements extending outwardly from the stepped walls, each flange element defining an engagement slot; a first heatsink positioned on the wall between the stepped walls; a second heatsink; a power module between the first heatsink and the second heatsink; and a second plate including: a plate wall extending across the second heatsink, transition walls extending from opposite sides of the plate wall, and prongs extending from the transition walls toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heatsink, wherein the prongs are aligned with and configured to engage the engagement slots.

Abstract: A cooling manifold assembly that is configured to cool power modules in a vehicle includes a planar cooling chamber with a supply inlet and a return outlet; a supply chamber in an upper portion of the planar cooling chamber that is in fluid communication with the supply inlet and configured to couple to adjacent planar cooling chambers at the supply inlet; a return chamber in a lower portion of the planar cooling chamber that is in fluid communication with the return outlet and configured to couple to adjacent planar cooling chambers at the return outlet; and an opening at a distal end of the planar cooling chamber fluidly connecting the supply chamber with the return chamber.

Abstract: A device (1) comprises: a cylindrical shell (4); a first spring (5) encased inside the cylindrical shell (4); a second spring (6) encased inside the cylindrical shell (4); a separator (13) in the cylindrical shell (4) separating the first and second springs (5, 6); a first end plate (12) on a first side (13a) of the separator (13) and a second end plate (11) on a second side (13b) of the separator (13); a first rod (2) and a second rod (3) passing openings (20a, 20b) provided at each end of the cylindrical shell (4), with the first rod (2) connected to the first end plate (12) and the second rod (3) connected to the second end plate (11); and a spacer (14) inserted between the first end plate (12) and the first spring (5).

Abstract: A cooling manifold assembly that is configured to cool power modules in a vehicle includes a planar cooling chamber with a supply inlet and a return outlet; a supply chamber in an upper portion of the planar cooling chamber that is in fluid communication with the supply inlet and configured to couple to adjacent planar cooling chambers at the supply inlet; a return chamber in a lower portion of the planar cooling chamber that is in fluid communication with the return outlet and configured to couple to adjacent planar cooling chambers at the return outlet; and an opening at a distal end of the planar cooling chamber fluidly connecting the supply chamber with the return chamber.

Abstract: A device (1) comprises: a cylindrical shell (4); a first spring (5) encased inside the cylindrical shell (4); a second spring (6) encased inside the cylindrical shell (4); a separator (13) in the cylindrical shell (4) separating the first and second springs (5, 6); a first end plate (12) on a first side (13a) of the separator (13) and a second end plate (11) on a second side (13b) of the separator (13); a first rod (2) and a second rod (3) passing openings (20a, 20b) provided at each end of the cylindrical shell (4), with the first rod (2) connected to the first end plate (12) and the second rod (3) connected to the second end plate (11); and a spacer (14) inserted between the first end plate (12) and the first spring (5).

Abstract: This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.

Abstract: A cooling device for an electric component may include a manifold with a coolant section having a coolant inlet trough and a coolant outlet trough. The device may further include a fluid turbulator having a turbulator plate with turbulator fins extending upwardly therefrom, and turbulator inlet openings and outlet openings through the turbulator plate, and a turbulator carrier surrounding the turbulator plate. The fluid turbulator may be installed between the coolant section and the electric component so that a heat exchange reservoir is defined by bottom surface of the electric component, the turbulator plate top surface and the turbulator carrier. Coolant from a coolant source may flow into the coolant inlet trough, through the turbulator inlet opening into the heat exchange reservoir, and out of the heat exchange reservoir through the turbulator outlet opening into the coolant outlet trough to remove heat from the electric component.

Abstract: A cooling device configured to be connected to an object having a surface is disclosed. The cooling device may include a manifold configured to be deposited directly onto the surface of the object, wherein the manifold includes a first side configured to be deposited directly onto the surface of the object, a cavity formed in the first side, an inlet channel fluidly connected to the cavity, and an outlet channel fluidly connected to the cavity. The cooling device may further include a turbulator configured to be deposited directly onto the surface of the object, wherein the turbulator extends into the cavity of the manifold.

Abstract: A cooling device configured to be connected to an object having a surface is disclosed. The cooling device may include a manifold configured to be deposited directly onto the surface of the object, wherein the manifold includes a first side configured to be deposited directly onto the surface of the object, a cavity formed in the first side, an inlet channel fluidly connected to the cavity, and an outlet channel fluidly connected to the cavity. The cooling device may further include a turbulator configured to be deposited directly onto the surface of the object, wherein the turbulator extends into the cavity of the manifold.

Abstract: This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.

Abstract: A cooling module for an electrical component is provided. The cooling module includes a housing defining an interior space for receiving a coolant. A flow directing member is arranged in the interior space of the housing. The flow directing member includes a plate that is divided into a plurality of discrete cells arranged parallel to each other with adjacent cells being separated from each other by a dividing wall. Each cell has an inlet opening in the plate through which coolant is directed onto a surface of the plate and an outlet opening in the plate through which coolant is directed off the surface of the plate. Each cell has a plurality of fins arranged on the surface of the plate in a herringbone pattern.