Abstract: A megasonic liquid stream semiconductor wafer cleaning apparatus and method uniformly removes debris from all points on the surface of a semiconductor wafer. The wafer is rotated about a proscribed axis while the means for producing focused megasonic waves and a liquid stream of cleaning fluid is focused on the wafer so as to apply sufficient energy to clean the wafer yet not cause damage to the electronic circuity embedded in the wafer. A method is provided for moving the outlet port providing the stream of megasonic cleaning fluid across the wafer so that the amount of energy applied to any area of the wafer is relatively constant.