Abstract: Apparatus and method are provided for making rf contact between the ground plane surface of a microwave-monolithic-integrated-circuit chip and a test fixture. The test fixture includes a chip support with a planar surface, a chip stop with a wedging surface, a clamp-release lever with a wedging surface, and a spring. The conductive ground plane surface of a MMIC chip is pressed against a planar surface with a contacting force that is a function of a clamping force that is applied to one of the wedging surfaces, and that is a function of angles of the wedging surfaces. Heat applied to the MMIC chip cooperates with the contacting force to provide a suitable rf connection between the ground plane surface of the chip and the planar surface of the test fixture.