Abstract: A card connector corresponding to a first card type associated with a plurality of electrical contacts for receiving cards corresponding to various card types, each card type associated with a set of electrical contacts fewer than, more than or the same number of electrical contacts as the first card type. An elongated body may be formed with a closed end and an open end. A cap may be positioned on the open end to configure the card connector in a closed configuration to support cards of a card type associated with fewer or the same number of electrical contacts. The cap may be removed to configure the card connector in an open configuration to support cards associated with more electrical contacts. The cap may have PCB connectors for positioning the cap a distance from the elongated body to configure the card connector in an augmented open configuration.

Abstract: Thermal coupling with between an electrical component, such as a CPU, and a heatsink can be provided by a movable heatsink insert separate from the heatsink. This movable heatsink insert can be placed on the electrical component. The heatsink can be thermally coupled to that additional thermal conductor. The heatsink, which is attached to the printed circuit board, is not in direct contact with the electrical component, reducing the likelihood that the heatsink could cause bending of the printed circuit board by pressing down on the electrical component. Further, a spring coupled between the heatsink and the movable heatsink insert can provide further pressure relief such that the heatsink assembly can be attached to an electrical component without applying excessive force to the electrical component.

Abstract: Thermal coupling with between an electrical component, such as a CPU, and a heatsink can be provided by a movable heatsink insert separate from the heatsink. This movable heatsink insert can be placed on the electrical component. The heatsink can be thermally coupled to that additional thermal conductor. The heatsink, which is attached to the printed circuit board, is not in direct contact with the electrical component, reducing the likelihood that the heatsink could cause bending of the printed circuit board by pressing down on the electrical component. Further, a spring coupled between the heatsink and the movable heatsink insert can provide further pressure relief such that the heatsink assembly can be attached to an electrical component without applying excessive force to the electrical component.