Patents by Inventor Edward Denison

Edward Denison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6465322
    Abstract: Methods and structures for determining alignment during semiconductor wafer processing are described. In one implementation, two geometric shapes are formed at different elevations over a substrate and at least partially overlapping with one another. The two shapes are inspected for overlap to determine whether the two shapes are misaligned. If the shapes are misaligned, a magnitude of misalignment is determined from the degree of overlap of the two shapes. In another implementation, a pair of elevationally spaced-apart geometric shapes are used to translate shifts of the shapes in one direction into quantifiable shift magnitudes using another direction. In yet another implementation, shifts in both the X and Y direction are readily quantifiable through visual inspection.
    Type: Grant
    Filed: January 15, 1998
    Date of Patent: October 15, 2002
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: David Ziger, Edward Denison, Pierre Leroux
  • Publication number: 20020048922
    Abstract: Methods and structures for determining alignment during semiconductor wafer processing are described. In one implementation, two geometric shapes are formed at different elevations over a substrate and at least partially overlapping with one another. The two shapes are inspected for overlap to determine whether the two shapes are misaligned. If the shapes are misaligned, a magnitude of misalignment is determined from the degree of overlap of the two shapes. In another implementation, a pair of elevationally spaced-apart geometric shapes are used to translate shifts of the shapes in one direction into quantifiable shift magnitudes using another direction. In yet another implementation, shifts in both the X and Y direction are readily quantifiable through visual inspection.
    Type: Application
    Filed: November 1, 2001
    Publication date: April 25, 2002
    Inventors: David Ziger, Edward Denison, Pierre Leroux
  • Publication number: 20010051441
    Abstract: Methods and structures for determining alignment during semiconductor wafer processing are described. In one implementation, two geometric shapes are formed at different elevations over a substrate and at least partially overlapping with one another. The two shapes are inspected for overlap to determine whether the two shapes are misaligned. If the shapes are misaligned, a magnitude of misalignment is determined from the degree of overlap of the two shapes. In another implementation, a pair of elevationally spaced-apart geometric shapes are used to translate shifts of the shapes in one direction into quantifiable shift magnitudes using another direction. In yet another implementation, shifts in both the X and Y direction are readily quantifiable through visual inspection.
    Type: Application
    Filed: January 15, 1998
    Publication date: December 13, 2001
    Inventors: DAVID ZIGER, EDWARD DENISON, PIERRE LEROUX