Patents by Inventor Edward E. Cooney

Edward E. Cooney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper to aluminum interlayer interconnect using stud and via liner
    Publication number: 20040207092
    Abstract: Tungsten studs of a size comparable to vias are provided to integrate and interface between copper and aluminum metallization layers in an integrated circuit and/or package therefor by lining a via opening, preferably with layers of tantalum nitride and PVD tungsten as a barrier against the corrosive effects of tungsten fluoride on copper. The reduced size of the tungsten studs relative to known interface structures allows wiring and connection pads to be formed in a single aluminum layer, improving performance and reducing process time and cost.
    Type: Application
    Filed: May 13, 2004
    Publication date: October 21, 2004
    Inventors: Lloyd G. Burrell, Edward E. Cooney, Jeffrey P. Gambino, John E. Heidenreich, Hyun Koo Lee, Mark D. Levy, Baozhen Li, Stephen E. Luce, Thomas L. McDevitt, Anthony K. Stamper, Kwong Hon Wong, Sally J. Yankee
  • Copper to aluminum interlayer interconnect using stud and via liner
    Publication number: 20020127846
    Abstract: Tungsten studs of a size comparable to vias are provided to integrate and interface between copper and aluminum metallization layers in an integrated circuit and/or package therefor by lining a via opening, preferably with layers of tantalum nitride and PVD tungsten as a barrier against the corrosive effects of tungsten fluoride on copper. The reduced size of the tungsten studs relative to known interface structures allows wiring and connection pads to be formed in a single aluminum layer, improving performance and reducing process time and cost.
    Type: Application
    Filed: March 12, 2001
    Publication date: September 12, 2002
    Inventors: Lloyd G. Burrell, Edward E. Cooney, Jeffrey P. Gambino, John E. Heidenreich, Hyun Koo Lee, Mark D. Levy, Baozhen Li, Stephen E. Luce, Thomas L. McDevitt, Anthony K. Stamper, Kwong Hon Wong, Sally J. Yankee