Patents by Inventor Edward Enciso

Edward Enciso has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7781843
    Abstract: High-voltage CMOS devices and low-voltage CMOS devices are integrated on a common substrate by forming a sacrificial film over at least active device areas, lithographically defining device active regions of the high-voltage CMOS devices, implanting dopants selectively through the sacrificial film into the lithographically defined device active regions of the high-voltage CMOS devices, diffusing the implanted dopants, removing the sacrificial film, and subsequently forming low-voltage CMOS devices.
    Type: Grant
    Filed: January 11, 2007
    Date of Patent: August 24, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Weaver, S. Jonathan Wang, John Chen, Sadiq Bengali, Edward Enciso, Tom Cooney
  • Patent number: 7486588
    Abstract: A method includes a row precharge voltage applied to a node and a column voltage that is set. A row enable signal is pulsed to a switching device coupled between the node and the column voltage to cause the node voltage to be lowered to a desired level.
    Type: Grant
    Filed: January 12, 2007
    Date of Patent: February 3, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Eric Martin, Edward Enciso, Stanley J. Wang
  • Publication number: 20070115740
    Abstract: A method includes a row precharge voltage applied to a node and a column voltage that is set. A row enable signal is pulsed to a switching device coupled between the node and the column voltage to cause the node voltage to be lowered to a desired level.
    Type: Application
    Filed: January 12, 2007
    Publication date: May 24, 2007
    Inventors: Eric Martin, Edward Enciso, Stanley Wang
  • Patent number: 7203111
    Abstract: An embodiment includes a first semiconductor element coupled between a precharge signal and a node, the first semiconductor element to allow current to flow from the precharge signal to the node when a positive voltage is present on the precharge signal, and a switching device coupled between the node and a voltage signal, the switching device to allow current flow between the node and the voltage signal when an enable signal is asserted.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: April 10, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Eric Martin, Edward Enciso, Stanley J. Wang
  • Publication number: 20060243934
    Abstract: The present invention is drawn to a method for modulating fluid flow in a micro-fluidic channel, comprising the step of applying heat to a valve of a micro-fluidic channeling device. The valve can include an elastically resilient portion having a first configuration prior to application of heat and a second configuration after application of heat. In one aspect, the first configuration provides an open valve configuration and the second configuration provides a closed valve configuration. In another aspect, the first configuration provides a closed valve configuration and the second configuration provides an open valve configuration.
    Type: Application
    Filed: April 28, 2005
    Publication date: November 2, 2006
    Inventors: Bradley Chung, Edward Enciso, Philip Harding
  • Publication number: 20060176746
    Abstract: An embodiment includes a first semiconductor element coupled between a precharge signal and a node, the first semiconductor element to allow current to flow from the precharge signal to the node when a positive voltage is present on the precharge signal, and a switching device coupled between the node and a voltage signal, the switching device to allow current flow between the node and the voltage signal when an enable signal is asserted.
    Type: Application
    Filed: February 8, 2005
    Publication date: August 10, 2006
    Inventors: Eric Martin, Edward Enciso, Stanley Wang