Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: The present invention discloses a reservoir which can be used on its own or inside of an insulated cooler to dispense liquids. The reservoir generally comprises a lid for retention of liquid and at least one opening in one vertical wall which is used to connect to a conduit which connects to a horizontally, non-gravity mounted coupling. The coupling connects to another conduit which connects to a spigot. The reservoir has a flat bottom surface, which allows for it to stand alone, outside of the insulated cooler if desired. The reservoir may also be placed inside the insulated cooler and in that case, the conduit connected to the spigot threads through one of the insulated cooler's walls to connect to the spigot to allow the flow of liquid to the exterior of the cooler.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: A method and apparatus for automatic resonance detection is disclosed for a motor-driven mechanical system such as a voice coil motor (VCM) in which a resonance detector and driver are provided. The automatic resonance detector may be implemented on the same integrated circuit as the driver, and dynamically determines the natural resonant frequency of the VCM driven by the driver. The resonant frequency is determined by measuring the back electromotive force (BEMF) of the VCM, detecting the slope of the BEMF signal, and determining the resonant frequency from the slope of the BEMF signal.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: A method and a device for detecting user input includes receiving a user input at an input arrangement of a user interface. The input arrangement has at least one piezoelectric sensor that generates an electric signal in response to the input. The electric signal is processed to determine the presence of the input. The processing may indicate the magnitude of the force of the input, in addition to the input's location. An output arrangement of the user interface generates an output in response to the processing. The output may be a haptic, audio or visual output.

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: A system is disclosed including a plurality of metal oxide varistors (MOVs) columns connected in parallel, and at least one fuse connected to an MOV column. The fuse(s) are configured to isolate the MOV column in the case that the fuse is activated.

Abstract: An apparatus, system and method for controlling drive patterns is disclosed. A digital engine for controlling drive patterns may include a profile controller to program characteristics of one or more drive patterns for one or more piezoelectric actuators. The digital engine may further include a register array to store profile information for the one or more drive patterns. Each drive pattern may comprise a plurality of pulses with each pulse having a slope. The digital engine may also include a digital pattern generator to generate the one or more drive patterns based upon the profile information stored in the register array. The digital engine may further include a slope shaping circuit to modify one or more signals based upon an input from the digital pattern generator.

Abstract: A device and method are provided to drive piezoelectric elements in haptic applications. In one embodiment, a pattern generator provides user programmable PWM waveforms to a driver. The load of the driver is an inductor in series with the piezoelectric element. The filtration of the inductor in series with the capacitance of the piezoelectric element suppresses the high-frequency components of the PWM pulse train, and recovers a value commensurate with the duty cycle of the PWM pulse train. The resulting waveform across the piezoelectric element is converted to physical motion, thereby creating a haptic effect on a user interface. Advantageously, there is reduced power loss, reduced switching induced noise, and a more haptic rich environment.

Abstract: The present invention provides a haptics control system that may include a driver to generate a continuous drive signal and to output the drive signal to a mechanical system on an electrical signal line, wherein the continuous drive signal causes the mechanical system to vibrate to produce a haptic effect. The haptics control system may further include a monitor, coupled to the electrical signal line, to capture a Back Electromotive Force (BEMF) signal generated by the mechanical system in the electrical signal line, to measure a BEMF signals attribute, and to transmit an adjustment signal to the driver based on the BEMF signals attribute. The driver is further configured to adjust the continuous drive signal according to the adjustment signal.

Abstract: Systems and methods for protecting a series capacitor bank are provided. According to one exemplary embodiment of the invention, there is disclosed a capacitor protection circuit. The capacitor protection circuit may include a capacitor bank, a pilot circuit and a main commutation gap. The pilot circuit and the main commutation gap may be provided in parallel electrical communication with the capacitor bank. Additionally, one or more plasma injectors may be provided in series electrical communication with the pilot circuit. The plasma injectors may be operable to provide partially or completely ionized plasma across the main commutation gap to make conductive the main commutation gap.