Patents by Inventor Edward F. Goldstein

Edward F. Goldstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrically conductive interconnection through a body of semiconductor material
    Patent number: 5528080
    Abstract: Conductive feed-throughs formed by partially migrating conductive material in a body of semiconductor material are used to provide electrical interconnections between the semiconductor surfaces. In addition, the conductive feed-throughs furnish mechanical support and thermal dissipation paths for the body of semiconductor material.
    Type: Grant
    Filed: December 13, 1994
    Date of Patent: June 18, 1996
    Inventor: Edward F. Goldstein
  • Electrically conductive interconnection through a body of semiconductor material
    Patent number: 5447871
    Abstract: Methods and structures of an etched-back thermomigrated interconnection which provides means for electrically connecting coplanar surfaces of a body of semiconductor material while concurrently providing means of making mechanical, electrical, and thermal external connections to the body of semiconductor material.
    Type: Grant
    Filed: March 5, 1993
    Date of Patent: September 5, 1995
    Inventor: Edward F. Goldstein