Abstract: A method is provided for erasing a memory device including a number of memory cells, the memory cells including a substrate, a control gate, a charge storage element, a source region and a drain region. The method includes erasing a group of memory cells to lower a maximum threshold voltage of the group of memory cells below a first predetermined level. The group of memory cells is soft-programmed to raise a minimum threshold voltage of the group of memory cells above a second predetermined level. The group of memory cells is erased, following soft-programming, resulting in a reduced threshold voltage distribution associated with the group of memory cells.

Abstract: A technique for forming at least part of an array of a dual bit memory core is disclosed. Initially, a portion of a charge trapping dielectric layer is formed over a substrate and a resist is formed over the portion of the charge trapping dielectric layer. The resist is patterned and a pocket implant is performed at an angle to establish pocket implants within the substrate. A bitline implant is then performed to establish buried bitlines within the substrate. The patterned resist is then removed and the remainder of the charge trapping dielectric layer is formed. A wordline material is formed over the remainder of the charge trapping dielectric layer and patterned to form wordlines that overlie the bitlines. The pocket implants serve to mitigate, among other things, complementary bit disturb (CBD) that can result from semiconductor scaling. As such, semiconductor devices can be made smaller and increased packing densities can be achieved by virtue of the inventive concepts set forth herein.

Abstract: A method for controlling gate voltage in a memory device is described. The method includes providing a circuit that is adapted to be coupled with the memory device. The circuit is for generating a reference voltage. The method further includes utilizing the reference voltage provided by the circuit to apply a voltage at a gate of the memory device. The voltage has a value corresponding to a temperature of the memory device. The method also includes retaining a proportional relationship between the reference voltage and the temperature of the memory device, regardless of the change in the temperature of the memory device. The reference voltage provides a substantially constant programming time for the memory device regardless of the temperature of the memory device.

Abstract: The present invention is a method and system for erasing a nitride memory device. In one embodiment of the present invention, an isolated P-well is formed in a semiconductor substrate. A plurality of N-type impurity concentrations are formed in the isolated P-well and a nitride memory cell is fabricated between two of the N-type impurity concentrations. Finally, an electrical contact is coupled to the isolated P-well.

Abstract: A method of programming a dual cell memory device having a first charge storing cell and a second charge storing cell. The method can include applying an initial program pulse to the memory device; comparing the threshold voltage of the memory device with a verify threshold voltage; and if the threshold voltage of the memory device is less than the verify threshold voltage, applying a second program pulse to the memory device during which at least one condition of the second program pulse is modified from the initial program pulse.

Abstract: A method of detecting a charge stored on a charge storage region of a first dual bit dielectric memory cell within an array of dual bit dielectric memory cells comprises grounding a first bit line that forms a source junction with a channel region of the first memory cell. A high voltage is applied to a gate of the first memory cell and to a second bit line that is the next bit line to the right of the first bit line and separated from the first bit line only by the channel region. A third bit line, that is the next bit line to the right of the second bit line, is isolated such that its potential is effected only by its junctions with the a second channel region and a third channel region on opposing sides of the third bit line. A high voltage is applied to a pre-charge bit line that is to the right of the third bit line and current flow is detected at the second bit line to determine the programmed status of a source bit of the memory cell.

Abstract: The present invention is a method and system for erasing a nitride memory device. In one embodiment of the present invention, an isolated P-well is formed in a semiconductor substrate. A plurality of N-type impurity concentrations are formed in the isolated P-well and a nitride memory cell is fabricated between two of the N-type impurity concentrations. Finally, an electrical contact is coupled to the isolated P-well.

Abstract: A method of programming a dual cell memory device having a first charge storing cell and second charge storing cell. The first charge storing cell can be pre-read to determine if the first charge storing cell stores an amount of charge to increase a threshold voltage of the memory device over a specified threshold voltage. If not, the second charge storing cell can be programmed with a standard program pulse. If so, the second charge storing cell can be programed with a modified program pulse.

Abstract: A method of detecting a charge stored on a charge storage region of a first dual bit dielectric memory cell within an array of dual bit dielectric memory cells comprises grounding a first bit line that forms a source junction with a channel region of the first memory cell. A high voltage is applied to a gate of the first memory cell and to a second bit line that is the next bit line to the right of the first bit line and separated from the first bit line only by the channel region. A third bit line, that is the next bit line to the right of the second bit line, is isolated such that its potential is effected only by its junctions with the a second channel region and a third channel region on opposing sides of the third bit line. A high voltage is applied to a pre-charge bit line that is to the right of the third bit line and current flow is detected at the second bit line to determine the programmed status of a source bit of the memory cell.

Abstract: A method of programming a memory unit having a plurality of dual cell core memory devices and at least one dual cell dynamic reference device. The memory unit is subjected to an erase configuration operation such that each cell of the core memory devices is in a blank state and such that a threshold voltage of the at least one dynamic reference device is less than a charged program level threshold voltage. Thereafter, the at least one dynamic reference and the core memory devices are programmed using a page programming routine.