Patents by Inventor Edward F. Stephens, IV
Edward F. Stephens, IV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11543223Abstract: An ammunition cartridge including a case, an ignitable material within the case and an optical primer for igniting the ignitable material. The optical primer includes a conductive cylindrical cup electrically coupled to the case and a circular conductive button including a top button portion positioned in the cup and a bottom button portion extending through an opening in the cup, where the button and the cup are electrically isolated. The optical primer further includes a first bracket electrically coupled to the button, a second bracket electrically coupled to the cup, and a pair of laser diodes electrically coupled in a reverse parallel direction and being electrically coupled to the first and second brackets, where one of the laser diodes generates a laser beam that ignites the ignition material in response to a current flow in either direction through the case, the cup and the button.Type: GrantFiled: November 18, 2021Date of Patent: January 3, 2023Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Kevin L. Callan, Andrew M. Singleton, Ryan M. Crittenden, Michael L. Fisher, Wade Collins, Francis L. Struemph, Edward F. Stephens, IV
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Publication number: 20220074725Abstract: An ammunition cartridge including a case, an ignitable material within the case and an optical primer for igniting the ignitable material. The optical primer includes a conductive cylindrical cup electrically coupled to the case and a circular conductive button including a top button portion positioned in the cup and a bottom button portion extending through an opening in the cup, where the button and the cup are electrically isolated. The optical primer further includes a first bracket electrically coupled to the button, a second bracket electrically coupled to the cup, and a pair of laser diodes electrically coupled in a reverse parallel direction and being electrically coupled to the first and second brackets, where one of the laser diodes generates a laser beam that ignites the ignition material in response to a current flow in either direction through the case, the cup and the button.Type: ApplicationFiled: November 18, 2021Publication date: March 10, 2022Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: KEVIN L. CALLAN, ANDREW M. SINGLETON, RYAN M. CRITTENDEN, MICHAEL L. FISHER, WADE COLLINS, FRANCIS L. STRUEMPH, EDWARD F. STEPHENS, IV
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Patent number: 11209257Abstract: An optical primer for igniting an ignition material in an ammunition cartridge. The primer includes a conductive cylindrical cup electrically coupled to a cartridge case and a circular conductive button including a top button portion positioned in the cup and a bottom button portion extending through an opening in the cup, where the button and the cup are electrically isolated. The primer further includes a first bracket electrically coupled to the button, a second bracket electrically coupled to the cup, and a pair of laser diodes electrically coupled in a reverse parallel direction and being electrically coupled to the first and second brackets, where one of the laser diodes generate a laser beam that ignites the ignition material in response to a current flow in either direction through the case, the cup and the button.Type: GrantFiled: December 12, 2019Date of Patent: December 28, 2021Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Kevin L. Callan, Andrew M. Singleton, Ryan M. Crittenden, Michael L. Fisher, Wade Collins, Francis L. Struemph, Edward F. Stephens, IV
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Publication number: 20210278187Abstract: An optical primer for igniting an ignition material in an ammunition cartridge. The primer includes a conductive cylindrical cup electrically coupled to a cartridge case and a circular conductive button including a top button portion positioned in the cup and a bottom button portion extending through an opening in the cup, where the button and the cup are electrically isolated. The primer further includes a first bracket electrically coupled to the button, a second bracket electrically coupled to the cup, and a pair of laser diodes electrically coupled in a reverse parallel direction and being electrically coupled to the first and second brackets, where one of the laser diodes generate a laser beam that ignites the ignition material in response to a current flow in either direction through the case, the cup and the button.Type: ApplicationFiled: December 12, 2019Publication date: September 9, 2021Inventors: KEVIN L. CALLAN, ANDREW M. SINGLETON, RYAN M. CRITTENDEN, MICHAEL L. FISHER, WADE COLLINS, FRANCIS L. STRUEMPH, EDWARD F. STEPHENS, IV
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Publication number: 20170117683Abstract: A laser diode array having submounts allowing thermal transmission from laser diode bars to a heat exchanger while electrically isolating the laser diode bars from the heat exchanger. The laser diode array has a plurality of laser diode bars supported by a corresponding plurality of submounts. Each of the submounts has a submount core having a top surface, an opposite bottom surface and side surfaces. An electrically conductive layer covers part of one side surface. The conductive layer is in electrical contact with one of the laser diode bars. Another electrically conductive layer covers part of a second side surface. An electrical connector connects the electrically conductive layers on the side surfaces. The electrically conductive layers leave an exposed area of the side surfaces adjacent to the bottom surface. The heat exchanger is in thermal contact with the bottom surface of each of the submount cores.Type: ApplicationFiled: October 22, 2015Publication date: April 27, 2017Inventors: Jeremy Scott Junghans, Edward F. Stephens, IV, Courtney Ryan Feeler
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Patent number: 9590388Abstract: A laser system that allows transverse arrangement of laser emitters around a laser medium. The system includes a laser medium with a coolant source and electrical controls. A pump layer has a mounting surface, an opposite bottom surface and a center aperture through which the laser medium is inserted. Laser diode emitters are disposed on the mounting surface circumferentially around the laser medium. An intermediate layer has at least one radial channel in fluid communication with the coolant conduit. The intermediate layer is in contact with the bottom surface. A middle layer has micro-channels formed therethrough and a center aperture. The micro-channels are radially arranged around the center aperture and the middle layer is in contact with the intermediate layer. The coolant source is fluidly coupled to the micro-channels to allow coolant to be directed through the microchannels and the radial channel to impinge on the bottom surface.Type: GrantFiled: January 11, 2011Date of Patent: March 7, 2017Assignee: Northrop Grumman Systems Corp.Inventors: Edward F. Stephens, IV, Courtney Ryan Feeler, Jeremy Scott Junghans
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Patent number: 8518814Abstract: A method of fabricating a high-density laser diode stack is disclosed. The laser diode bars each have an emitter surface and opposing surfaces on either side of the emitter surface. Each laser diode bar has metallization layers on the opposing surfaces and a solder layer on at least one of the metallization layers. The solder layer is applied to a semiconductor wafer prior to cleaving the wafer to create the laser diode bars. The laser diode bars are arranged in a stack such that the emitter surfaces of the bars are facing the same direction. The stack of laser diode bars is placed in a vacuum chamber. An anti-reflection coating is deposited on the emitter surfaces of the laser diode bars in the chamber. The laser diode bars are joined by applying a temperature sufficient to reflow the solder layers in the chamber.Type: GrantFiled: December 2, 2011Date of Patent: August 27, 2013Assignee: Northrop Grumman Systems CorporationInventors: Edward F. Stephens, IV, Frank L. Struemph, Jeremy Scott Junghans
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Publication number: 20130143338Abstract: A method of fabricating a high-density laser diode stack is disclosed. The laser diode bars each have an emitter surface and opposing surfaces on either side of the emitter surface. Each laser diode bar has metallization layers on the opposing surfaces and a solder layer on at least one of the metallization layers. The solder layer is applied to a semiconductor wafer prior to cleaving the wafer to create the laser diode bars. The laser diode bars are arranged in a stack such that the emitter surfaces of the bars are facing the same direction. The stack of laser diode bars is placed in a vacuum chamber. An anti-reflection coating is deposited on the emitter surfaces of the laser diode bars in the chamber. The laser diode bars are joined by applying a temperature sufficient to reflow the solder layers in the chamber.Type: ApplicationFiled: December 2, 2011Publication date: June 6, 2013Applicant: Northrop Grumman Systems Corp.Inventors: Edward F. Stephens, IV, Frank L. Struemph, Jeremy Scott Junghans
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Patent number: 8345720Abstract: A laser diode package includes a laser diode, a cooler, and control circuitry, such as an integrated circuit. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets. The ceramic sheets are fused together. The ceramic sheets include traces or vias that provide electrically conductive paths to the integrated circuit. The control circuitry controls the output of the laser diode, e.g. the output at each of the laser diode's emitters. Multiple laser diode packages are placed together to form an array.Type: GrantFiled: July 22, 2010Date of Patent: January 1, 2013Assignee: Northrop Grumman Systems Corp.Inventors: Edward F. Stephens, IV, Courtney Ryan Feeler, Jeremy Scott Junghans
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Publication number: 20120177073Abstract: A laser system that allows transverse arrangement of laser emitters around a laser medium. The system includes a laser medium with a coolant source such as a pump and electrical controls. A pump layer has a mounting surface, an opposite bottom surface and a center aperture through which the laser medium is inserted. A plurality of laser diode emitters are disposed on the mounting surface of the pump layer circumferentially around the laser medium. An intermediate layer has at least one radial channel in fluid communication with the coolant conduit of the pump layer. The intermediate layer is in contact with the bottom surface of the pump layer. A middle layer has a plurality of micro-channels formed therethrough and a center aperture. The micro-channels are radially arranged around the center aperture and the middle layer in contact with the intermediate layer.Type: ApplicationFiled: January 11, 2011Publication date: July 12, 2012Applicant: Northrop Grumman Systems Corp.Inventors: Edward F. Stephens, IV, Courtney Ryan Feeler, Jeremy Scott Junghans
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Publication number: 20110026551Abstract: A laser diode package includes a laser diode, a cooler, and control circuitry, such as an integrated circuit. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets. The ceramic sheets are fused together. The ceramic sheets include traces or vias that provide electrically conductive paths to the integrated circuit. The control circuitry controls the output of the laser diode, e.g. the output at each of the laser diode's emitters. Multiple laser diode packages are placed together to form an array.Type: ApplicationFiled: July 22, 2010Publication date: February 3, 2011Applicant: Northrop Grumman Systems Corp.Inventors: Edward F. Stephens, IV, Courtney Ryan Feeler, Jeremy Scott Junghans
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Patent number: 7860136Abstract: A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42).Type: GrantFiled: October 23, 2007Date of Patent: December 28, 2010Assignee: Northrop Grumman Systems CorporationInventors: Edward F. Stephens, IV, Joseph L Levy, John S. Whiteley
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Patent number: 7724791Abstract: A laser diode package according to the present invention is composed of CTE mismatched components soldered together. The laser diode package includes a laser diode bar, at least one heat sink, and at least one exothermic layer. Solder layers are adjacent the heat sink(s) and laser diode bar, respectively. The exothermic layer(s) are positioned between the solder layers. The exothermic layer(s) are exposed to an energy source which causes an exothermic reaction to propagate through the exothermic layer thereby melting the solder layers and solder layers. The exothermic layer(s) may be designed to provide sufficient heat to melt the solder layers and solder layers but provide only minimal heat to the laser diode bar and heat sink(s). Several packages can be stacked together to form a laser diode array.Type: GrantFiled: January 18, 2008Date of Patent: May 25, 2010Assignee: Northrop Grumman Systems CorporationInventor: Edward F. Stephens, IV
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Publication number: 20090185593Abstract: A laser diode package according to the present invention is composed of CTE mismatched components soldered together. The laser diode package includes a laser diode bar, at least one heat sink, and at least one exothermic layer. Solder layers are adjacent the heat sink(s) and laser diode bar, respectively. The exothermic layer(s) are positioned between the solder layers. The exothermic layer(s) are exposed to an energy source which causes an exothermic reaction to propagate through the exothermic layer thereby melting the solder layers and solder layers. The exothermic layer(s) may be designed to provide sufficient heat to melt the solder layers and solder layers but provide only minimal heat to the laser diode bar and heat sink(s). Several packages can be stacked together to form a laser diode array.Type: ApplicationFiled: January 18, 2008Publication date: July 23, 2009Inventor: Edward F. Stephens, IV
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Patent number: 7330491Abstract: A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42).Type: GrantFiled: April 20, 2004Date of Patent: February 12, 2008Assignee: Northrop Grumman Space & Missions Systems CorporationInventors: Edward F. Stephens, IV, Joseph L. Levy, John S. Whiteley
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Patent number: 6728275Abstract: A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42).Type: GrantFiled: September 19, 2002Date of Patent: April 27, 2004Assignee: TRW Inc.Inventors: Edward F. Stephens, IV, Joseph L. Levy, John S. Whiteley