Abstract: A tweezer-type heating device for installation and removal device of electronic components with respect to a substrate, such as for SMC installation and through hole installation or removal. More specifically, a handheld tweezer-type heating device is provided in which a wide variety of different sized (and shaped) tips can be used with a high degree of accuracy in terms of thermo/mechanical contact. Tolerances in the parts of the handpiece, the assembly, the heaters and the tips that may bring the bottom edges of the tips out of their alignment plane are very easily corrected with an adjustable hinge which, by loosening of a screw and sliding the parts with respect to each other, allows proper alignment to be achieved. Still further, a thumb screw is provided at the back of the handpiece to allow the gap between the tips to be slightly opened or closed. This is useful in accommodating tolerances in the components.