Abstract: A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit chip, whose surface has corresponding etch pit wells that mate with the etch pit wells of the first integrated circuit chip. Spherical balls are placed in the etch pit wells of the first integrated circuit chip such that when the corresponding etch pit wells of the second integrated circuit chip are substantially aligned with the spherical balls, the spherical balls mate with the etch well pits of the second integrated circuit chip, thereby precisely aligning the first integrated circuit chip with the second integrated circuit chip.

Abstract: A dock line server (1) attachable to a conventional line pole (3) for use in maintaining a loop (8) in a dock line (3) in a horizontal configuration to facilitate placement of the dock line over a mooring piling (9) or cleat when docking a boat. The frame of the server has a pair of prongs (5) which are connected at a proximal end (20) and spaced apart a predetermined distance to form an opening at a distal end (19). At least one pair of horseshoe-shaped clips (6) on top of each prong holds the dock line in a horizontal, open loop configuration during docking. A pair of spacers (7) on each prong may also be used to hold the middle of the loop in a fully open position. The dock line server is preferably hollow and made of lightweight material, such as aluminum.

Abstract: A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.