Patents by Inventor Edward Franklin Stephens, IV

Edward Franklin Stephens, IV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser diode package with an internal fluid cooling channel
    Patent number: 7466732
    Abstract: A laser diode assembly has a laser diode. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode has first and second side surfaces between the emitting and reflective surfaces. A first electrically-insulating heat sink is attached to the first side surface of the laser diode via a first solder bond, and the first heat sink has a first cooling channel. A second electrically-insulating heat sink is attached to the second side surface of the laser diode via a second solder bond, and the second electrically-insulating heat sink has a second cooling channel. A substrate has a top side and a bottom side, and the top side being in communication with a first bottom side of the first electrically-insulating heat sink and a second bottom side of the second electrically-insulating heat sink. The substrate has a flow channel system for passing a coolant to the first cooling channel and the second cooling channel.
    Type: Grant
    Filed: November 9, 2007
    Date of Patent: December 16, 2008
    Assignee: Northrop Grumman Corporation
    Inventor: Edward Franklin Stephens, IV
  • Laser diode package with an internal fluid cooling channel
    Patent number: 7305016
    Abstract: A laser diode assembly has a laser diode. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode has first and second side surfaces between the emitting and reflective surfaces. A first electrically-insulating heat sink is attached to the first side surface of the laser diode via a first solder bond, and the first heat sink has a first cooling channel. A second electrically-insulating heat sink is attached to the second side surface of the laser diode via a second solder bond, and the second electrically-insulating heat sink has a second cooling channel. A substrate has a top side and a bottom side, and the top side being in communication with a first bottom side of the first electrically-insulating heat sink and a second bottom side of the second electrically-insulating heat sink. The substrate has a flow channel system for passing a coolant to the first cooling channel and the second cooling channel.
    Type: Grant
    Filed: March 10, 2005
    Date of Patent: December 4, 2007
    Assignee: Northrop Grumman Corporation
    Inventor: Edward Franklin Stephens, IV