Patents by Inventor Edward G. Marvin

Edward G. Marvin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical solder ball contact
    Patent number: 6641410
    Abstract: An electrical contact including a contact end having a gold-plated surface for receiving a solder ball and edge surfaces adjacent to the gold surface for containing the solder ball on the gold-plated surface. In one embodiment, the contact end is connected to a curved lead and a portion of the contact end adjacent to the curved lead is comprised a less solder-wettable material than gold. A method of fabricating the electrical contact includes plating a metal sheet with a gold stripe and stamping the sheet to provide the contact surface in the gold stripe. Also described is an electrical connector having a plurality of conductive contacts, each having a gold-coated surface for receiving a solder ball and less solder-wettable edge surfaces adjacent to the gold surface.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: November 4, 2003
    Assignee: Teradyne, Inc.
    Inventors: Edward G. Marvin, David M. McNamara
  • Electrical solder ball contact
    Publication number: 20020187688
    Abstract: An electrical contact including a contact end having a gold-plated surface for receiving a solder ball and edge surfaces adjacent to the gold surface for containing the solder ball on the gold-plated surface. In one embodiment, the contact end is connected to a curved lead and a portion of the contact end adjacent to the curved lead is comprised a less solder-wettable material than gold. A method of fabricating the electrical contact includes plating a metal sheet with a gold stripe and stamping the sheet to provide the contact surface in the gold stripe. Also described is an electrical connector having a plurality of conductive contacts, each having a gold-coated surface for receiving a solder ball and less solder-wettable edge surfaces adjacent to the gold surface.
    Type: Application
    Filed: June 7, 2001
    Publication date: December 12, 2002
    Inventors: Edward G. Marvin, David M. McNamara