Abstract: A thermoplastic bag includes duplicative seals. In particular, in one or more implementations, a thermoplastic bag includes a first seal and at least a second seal reinforcing the same area of the thermoplastic bag. For instance, in one or more implementations, the thermoplastic bag includes multiple seals along each side edge or along the hem. If one seal fails, the other seal(s) can remain in place to prevent leaks. Thus, the duplicative seals of the thermoplastic bag can provide reinforced strength and desired aesthetics.

Abstract: Thermoplastic bags with phased deformation patterns are described. In particular, one or more implementations comprise thermoplastic bags with ring rolling, SELFing, or other deformation patterns phased or aligned relative to the sides of the bags. The phased deformation patterns can allow for reducing or eliminating deformation patterns in areas of the thermoplastic bag in which side seals or other seals are formed. Additionally or alternatively, the phased deformation patterns can provide for zones that provide differing properties (e.g., functional or aesthetic). Such zones can vary aligned along a width of the thermoplastic bag and optionally also vary along a height of the thermoplastic bag. The differing zones can provide the thermoplastic bags with phased deformations that provide leak prevention, liquid containment, and other benefits.

Abstract: A radio frequency (RF) satellite antenna may include an antenna housing to be carried by the satellite and having first and second opposing antenna element storage compartments. The antenna may further include a first plurality of self-deploying conductive antenna elements moveable between a first stored position within the first antenna element storage compartment, and a first deployed position extending outwardly from the canister and defining a first conical antenna. The antenna may also include a second plurality of self-deploying conductive antenna elements moveable between a second stored position within the second antenna element storage compartment, and a second deployed position extending outwardly from the canister and defining a second conical antenna. The first and second conical antennas may extend in opposing directions and defining a biconical antenna when in the first and second deployed positions.

Abstract: A radio frequency (RF) satellite antenna may include an antenna housing to be carried by the satellite and having first and second opposing antenna element storage compartments. The antenna may further include a first plurality of self-deploying conductive antenna elements moveable between a first stored position within the first antenna element storage compartment, and a first deployed position extending outwardly from the canister and defining a first conical antenna. The antenna may also include a second plurality of self-deploying conductive antenna elements moveable between a second stored position within the second antenna element storage compartment, and a second deployed position extending outwardly from the canister and defining a second conical antenna. The first and second conical antennas may extend in opposing directions and defining a biconical antenna when in the first and second deployed positions.

Abstract: A multi-chip module has an integral capacitor element embedded within the substrate and comprises a plurality of substrate layers forming a multi-chip module substrate. The substrate has a cut edge and forms at the cut edge a bondable edge. A via is formed in the substrate, and a dielectric capacitive material fills the via for a plurality of substrate layers and defines a multilayer capacitor. The multilayer capacitor and via are positioned at the bondable edge and connects to the bondable edge. In one aspect, the via having the dielectric capacitive material is positioned at the cut edge, and includes a conductive material filling at least a portion of the cut via to form the bondable edge. The dielectric capacitive material and bondable edge form a junction surface. A signal trace can be formed on a substrate layer and connected to the capacitor to form a DC blocking capacitor structure. A ground line can be formed on one substrate layer and engage the capacitive material.

Abstract: A phased array antenna includes an antenna housing including a subarray assembly and a plurality of beam forming network modules positioned on the subarea assembly. An antenna support and interconnect member are mounted on the antenna housing and include a carrier member having a front antenna mounting surface substantially orthogonal to the module support for supporting at least one antenna element. A rear surface has a receiving slot. At least one conductive via is associated with the receiving slot and positioned to extend through the carrier member to a circuit element, such as an antenna element, supported by the mounting surface. A launcher member is fitted into the receiving slot and has a module connecting end that extends rearward to a beam forming network. The launcher member includes conductive signal traces that extend along the launcher member from the conductive via to the module connecting end.

Abstract: A multi-chip module has an integral capacitor element embedded within the substrate and includes a plurality of substrate layers forming a multi-chip module substrate. The substrate has a cut edge and forms at the cut edge a bondable edge. A via is formed in the substrate, and a dielectric capacitive material fills the via for a plurality of substrate layers and defines a multilayer capacitor. The multilayer capacitor and via are positioned at the bondable edge and connects to the bondable edge. In one aspect, the via having the dielectric capacitive material is positioned at the cut edge, and includes a conductive material filling at least a portion of the cut via to form the bondable edge. The dielectric capacitive material and bondable edge form a junction surface. A signal trace can be formed on a substrate layer and connected to the capacitor to form a DC blocking capacitor structure. A ground line can be formed on one substrate layer and engage the capacitive material.

Abstract: The apparatus can distribute and collect air. As a collector, a fan draws air from the proximal end of an elongated tube disposed in an air-environment. The tube is closed at the distal end but receives air all along its length through its air-permeable wall. The wall is more permeable to air at its distal end than at its proximal end. Wall permeability gradually increases from the proximal end to the distal end so that a substantially constant rate of air ingestion occurs at all points along the wall. A reversal of the airflow direction converts the air collector into an air distributor for distributing air evenly along its length.

Abstract: A packaging assembly for a semiconductor circuit chip is formed of a hermetically sealable, `tub`-like structure. The tub-like structure is comprised a laminated stack of thin layers of low temperature co-fired ceramic (LTCC) material. The laminated stack of LTCC layers contains an internally distributed network of interconnect links through which a semiconductor die, that has been mounted at a floor portion of the tub, may be electrically connected to a plurality of conductive recesses or pockets located at top and bottom sidewall edge portions of the tub, thereby allowing multiple tubs to be joined together as a hermetically sealed assembly and electrically interconnected at the conductive pockets of adjacent tubs.

Abstract: A packaging assembly for a semiconductor circuit chip is formed of a hermetically sealable, `tub`-like structure. The tub-like structure is comprised a laminated stack of thin layers of low temperature co-fired ceramic (LTCC) material. The laminated stack of LTCC layers contains an internally distributed network of interconnect links through which a semiconductor die, that has been mounted at a floor portion of the tub, may be electrically connected to a plurality of conductive recesses or pockets located at top and bottom sidewall edge portions of the tub, thereby allowing multiple tubs to be joined together as a hermetically sealed assembly and electrically interconnected at the conductive pockets of adjacent tubs.

Abstract: A self-sufficient apparatus and method for conveying solar heat energy from an attic (20) under a solar energy absorbing roof (10) to a place remote from the attic. A synergetic combination of in-attic air controlling devices such as fans and motorized vents (40a, 40b) are energized by stored electrical energy generated by a sunlight-to-electrical-energy panel (14), located adjacent the roof. The panel, preferably a photovoltaic array, has a limited size, providing just sufficient electrical energy to operate the electrical elements of the apparatus. It will not impair the heat absorbing capability of the roof and can be located where it is not aesthetically objectionable. In a preferred embodiment a forced-air-to-water heat exchanger (30) provides solar heated domestic hot water (90). In another embodiment solar heated attic air is drawn into a fan (50) and forced via a duct to another part of the building (100).

Abstract: The "unmodified" roof (32) and "unmodified" attic (34), of a residential or similar building, are used in conjunction with an "attic based" air to liquid forced air heat exchanger (46) to form an active "attic solar energy vehicle". This solar (30) based system is used to heat swimming pools, spas, hot tubs, domestic hot water and in providing space heating/cooling and in cooling overheated swimming pools or other bodies of water--in a cost efficient way. Low operating cost forced air convection principles that make use of the temperature differentials present are applied. The "unmodified" roof (32) functions as a massive solar (30) collector. The "unmodified" attic (34) functions as a heat transfer and storage medium. The forced air to liquid heat exchanger (46) takes hot attic (34) air directly off of the interior of the roof structure (32) and transfers it to water or other liquid.