Abstract: An improved method for minimizing interferences from random noise and correlated fluctuations which obscure electrical signals converted from optical emissions. In particular, an improved method for the removal of interferences from optical emission signals during endpoint determination in dry etching processes for the fabrication of micro-electronic devices which derives information in the presence of random noise, correlated fluctuations and periodic modulations of the plasma by maximizing the signal to random noise ratio and minimizing the obscuring effects of correlated fluctuation.

Abstract: An improved method for minimizing interferences from random noise and correlated fluctuations which obscure electrical signals converted from optical emissions. In particular, an improved method for the removal of interferences from optical emission signals during endpoint determination in dry etching processes for the fabrication of micro-electronic devices which derives information in the presence of random noise, correlated fluctuations and periodic modulations of the plasma by maximizing the signal to random noise ratio and minimizing the obscuring effects of correlated fluctuation.

Abstract: An improved method for minimizing interferences from random noise and correlated fluctuations which obscure electrical signals converted from optical emissions. In particular, an improved method for the removal of interferences from optical emission signals during endpoint determination in dry etching processes for the fabrication of microelectronic devices which derives information in the presence of random noise, correlated fluctuations and periodic modulations of the plasma by maximizing the signal to random noise ratio and minimizing the obscuring effects of correlated fluctuation.

Abstract: A device for the optical measurement of light transmitted through silicon wafers and other media during the manufacture of electronic components and particularly during processing within a spray environment. The device is characterized by being a stationary assembly designed to provide structurally inherent optical alignment and focus. In addition the device is provided with a geometry specifically designed to direct any condensate flow away from the surface of the wafer, and with surface characteristics which minimize droplet separation from the surface of the device within a spray environment. The device is designed to permit its location out of the main spray pattern. The light source of the device is made as small as possible to minimize intrusion into the process environment.