Patents by Inventor Edward H. Sebesta

Edward H. Sebesta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5253799
    Abstract: A system for construction of a multi-sided solid shaped carton, package, or similar multi-sided structure including a flat blank having multiple polygon shaped faces, each face hingably connected to at least one other face, having free edges of the faces connectable to free edges of other faces to form a multi-sided carton, a first edge forming element for connecting a first pair of free edges with a first degree of holding force, and a second edge forming element for connecting a second pair of free edges with a second degree of holding force which is greater than said first degree of holding force. A unique symbol code is used for drawing attention to the preferred starting point of construction, for designating the appropriate correspondence between tab and slotted flap edge forming elements, and for designating the preferred order of assembly.
    Type: Grant
    Filed: September 20, 1990
    Date of Patent: October 19, 1993
    Inventor: Edward H. Sebesta
  • Patent number: 4497684
    Abstract: An improved method is set out for depositing a metal on a substrate to form a metal pattern. The method is particularly useful for the deposition of metal grids which form portions of microcircuits. The substrate is covered with a first sacrificial layer which is covered with a rigid second sacrificial layer which in turn is covered with a photoresist layer. The pattern which is to be deposited on the substrate is extended through the second sacrificial layer. Sufficient of the first sacrificial layer is removed to undercut the second sacrificial layer and to provide an overhanging lip portion of at least about 1000 .ANG. overhang and an enlarged pattern on the substrate. Metal is deposited on the enlarged pattern and the first sacrificial layer is then eliminated while the metal pattern is left behind on the substrate.
    Type: Grant
    Filed: February 22, 1983
    Date of Patent: February 5, 1985
    Assignee: Amdahl Corporation
    Inventor: Edward H. Sebesta