Patents by Inventor Edward Hock Vui Lim

Edward Hock Vui Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of removing particles by adhesive
    Patent number: 5753563
    Abstract: The removal of particulate contaminants, such as dust particles, from the surface of a semiconductor wafer is achieved by pressing a soft adhesive layer against the wafer surface, leaving it in place for a short time and then removing it. The adhesive is brought to the wafer surface on a flexible medium which serves as a backing layer and to whose other side pressure can be applied. To remove the adhesive, the backing layer is peeled off, either by pulling on one end or by passing a sticky roller over it. The operation may be performed in air or under vacuum.
    Type: Grant
    Filed: July 30, 1997
    Date of Patent: May 19, 1998
    Assignee: Chartered Semiconductor Manufacturing Ltd.
    Inventors: Yong Yang Guan, Edward Hock Vui Lim