Abstract: An optical communication cable includes a jacket having an interior surface that defines a cable jacket internal cross-sectional area and a plurality of optical fibers, wherein less than 60% of the cable jacket internal cross-sectional area is occupied by the cross-sectional area of the plurality of optical fibers. A scaffolding structure is provided adjacent to and supporting the jacket such that when the jacket is subjected to a burn and melts, the melted jacket material bonds to the scaffolding structure rather than sloughing off.

Abstract: An optical fiber cable that includes subunits is provided. Optical fiber cables are used to transmit data over distance. Generally, large distribution cables that carry a multitude of optical fibers from a hub are sub-divided at network nodes into subunits. To furcate the subunits, the respective jackets of the subunits must balance many different characteristics, including flexibility, temperature tolerance, and safety properties.

Abstract: An optical fiber cable that includes subunits is provided. The cable has an outer jacket having a thickness of at least 2.0 millimeters and that is made from a fire retardant polymer material having a PHRR value of 222 kw/m2 when tested in a cone calorimeter measured according to ASTM E1354 with a heat flux of 50 kW/m2. The cable meets the requirement of UL 1666 burn test for riser cables and the requirements of EN 50399 burn test for CPR class Cca cables.

Abstract: Embodiments of an optical fiber cable are provided. The optical fiber cable includes an outer jacket, an inner jacket, a porous insulating layer, and at least one optical fiber. The outer jacket has a first thickness between its inner surface and its outer surface. The inner jacket has a second thickness between its inner surface and its outer surface. The inner jacket is disposed within the outer jacket. The porous insulating layer is disposed between the inner jacket and the outer jacket. The porous insulating layer is configured to reduce the transfer of heat to the inner jacket during combustion of the outer jacket. The optical fiber is disposed within the inner jacket. In the optical fiber cable, the first thickness is less than the second thickness, and each of the outer jacket and the inner jacket include at least one flame retardant additive.

Abstract: An optical cable is provided. The optical cable includes an outer cable body jacket and a plurality of optical fiber subunits. The optical fibers within each subunit are stranded relative to each other and are located within a thin subunit jacket. A plurality of unstranded optical fiber subunits are located within the cable jacket.

Abstract: An optical cable is provided. The optical cable includes an outer cable body jacket and a plurality of optical fiber subunits. The optical fibers within each subunit are stranded relative to each other and are located within a thin subunit jacket. A plurality of unstranded optical fiber subunits are located within the cable jacket.

Abstract: Embodiments of an optical fiber cable are provided. The optical fiber cable includes an outer jacket, an inner jacket, a porous insulating layer, and at least one optical fiber. The outer jacket has a first thickness between its inner surface and its outer surface. The inner jacket has a second thickness between its inner surface and its outer surface. The inner jacket is disposed within the outer jacket. The porous insulating layer is disposed between the inner jacket and the outer jacket. The porous insulating layer is configured to reduce the transfer of heat to the inner jacket during combustion of the outer jacket. The optical fiber is disposed within the inner jacket. In the optical fiber cable, the first thickness is less than the second thickness, and each of the outer jacket and the inner jacket include at least one flame retardant additive.

Abstract: Embodiments of an optical fiber cable are provided. The optical fiber cable includes an outer jacket, an inner jacket, a porous insulating layer, and at least one optical fiber. The outer jacket has a first thickness between its inner surface and its outer surface. The inner jacket has a second thickness between its inner surface and its outer surface. The inner jacket is disposed within the outer jacket. The porous insulating layer is disposed between the inner jacket and the outer jacket. The porous insulating layer is configured to reduce the transfer of heat to the inner jacket during combustion of the outer jacket. The optical fiber is disposed within the inner jacket. In the optical fiber cable, the first thickness is less than the second thickness, and each of the outer jacket and the inner jacket include at least one flame retardant additive.

Abstract: An optical communication cable includes a jacket having an interior surface that defines a cable jacket internal cross-sectional area and a plurality of optical fibers, wherein less than 60% of the cable jacket internal cross-sectional area is occupied by the cross-sectional area of the plurality of optical fibers. A scaffolding structure is provided adjacent to and supporting the jacket such that when the jacket is subjected to a burn and melts, the melted jacket material bonds to the scaffolding structure rather than sloughing off.

Abstract: An optical cable is provided. The optical cable includes an outer cable body jacket and a plurality of optical fiber subunits. The optical fibers within each subunit are stranded relative to each other and are located within a thin subunit jacket. A plurality of unstranded optical fiber subunits are located within the cable jacket.

Abstract: An optical cable is provided. The optical cable includes an outer cable body jacket and a plurality of optical fiber subunits. The optical fibers within each subunit are stranded relative to each other and are located within a thin subunit jacket. A plurality of unstranded optical fiber subunits are located within the cable jacket.

Abstract: A method of making a semiconductor device may include providing a carrier and forming a first photoresist over the carrier with first openings through the first photoresist. A non-planar conductive seed layer may be formed over the first photoresist and conformally extend into the first openings through the first photoresist. A second photoresist may be formed over the first photoresist and over the non-planar conductive seed layer. The second photoresist layer may be patterned to form second openings through the second photoresist that extend to the non-planar conductive seed layer. Conductive posts may be plated over the non-planar conductive seed layer and within the second openings. The second photoresist may be removed while leaving in place the first photoresist. A semiconductor die may be coupled to the carrier. The semiconductor die, the conductive posts, and the first photoresist may be encapsulated with mold compound.

Abstract: An optical communication cable is provided. The optical communication cable includes a cable jacket and a plurality of optical fiber subunits surrounded by the cable jacket. Each optical fiber subunit includes a subunit jacket and a plurality of optical fibers located within the subunit passage. Each optical fiber includes an outer polymer buffer coating, such as a tight buffer coating. The outer cable jacket and/or the outer polymer buffer coating of the optical fibers is formed from a halogen containing polymer material including a fire retardant material, and the subunit jacket is formed from a polyolefin polymer material including a fire retardant material.

Abstract: A method of making a semiconductor device may include providing a carrier and forming a first photoresist over the carrier with first openings through the first photoresist. A non-planar conductive seed layer may be formed over the first photoresist and conformally extend into the first openings through the first photoresist. A second photoresist may be formed over the first photoresist and over the non-planar conductive seed layer. The second photoresist layer may be patterned to form second openings through the second photoresist that extend to the non-planar conductive seed layer. Conductive posts may be plated over the non-planar conductive seed layer and within the second openings. The second photoresist may be removed while leaving in place the first photoresist. A semiconductor die may be coupled to the carrier. The semiconductor die, the conductive posts, and the first photoresist may be encapsulated with mold compound.

Abstract: Embodiments of an optical fiber cable are provided. The optical fiber cable includes an outer jacket, an inner jacket, a porous insulating layer, and at least one optical fiber. The outer jacket has a first thickness between its inner surface and its outer surface. The inner jacket has a second thickness between its inner surface and its outer surface. The inner jacket is disposed within the outer jacket. The porous insulating layer is disposed between the inner jacket and the outer jacket. The porous insulating layer is configured to reduce the transfer of heat to the inner jacket during combustion of the outer jacket. The optical fiber is disposed within the inner jacket. In the optical fiber cable, the first thickness is less than the second thickness, and each of the outer jacket and the inner jacket include at least one flame retardant additive.

Abstract: A method of making a semiconductor device may include providing a carrier and forming a first photoresist over the carrier with first openings through the first photoresist. A non-planar conductive seed layer may be formed over the first photoresist and conformally extend into the first openings through the first photoresist. A second photoresist may be formed over the first photoresist and over the non-planar conductive seed layer. The second photoresist layer may be patterned to form second openings through the second photoresist that extend to the non-planar conductive seed layer. Conductive posts may be plated over the non-planar conductive seed layer and within the second openings. The second photoresist may be removed while leaving in place the first photoresist. A semiconductor die may be coupled to the carrier. The semiconductor die, the conductive posts, and the first photoresist may be encapsulated with mold compound.

Abstract: The invention relates to an implantable device to deliver drug formulations through a nanoporous membrane. The current related arts for delivery of drug formulations include tablets, injections, implantable pellets, injectable polymer depots, and implantable infusion pumps. The invention employs a reservoir to contain the drug formulation, a nanoporous membrane, and a formulation of testosterone.

Abstract: The invention relates to an implantable device to deliver drug formulations through a nanoporous membrane. The current related arts for delivery of drug formulations include tablets, injections, implantable pellets, injectable polymer depots, and implantable infusion pumps. The invention employs a reservoir to contain the drug formulation, a nanoporous membrane, and a formulation of buprenorphine.

Abstract: The invention relates to an implantable device to deliver drug formulations through a nanoporous membrane. The current related arts for delivery of drug formulations include tablets, injections, implantable pellets, injectable polymer depots, and implantable infusion pumps. The invention employs a reservoir to contain the drug formulation, a nanoporous membrane, and a formulation of estrogen.

Abstract: The invention relates to an implantable device to deliver drug formulations through a nanoporous membrane. The current related arts for delivery of drug formulations include tablets, injections, implantable pellets, injectable polymer depots, and implantable infusion pumps. The invention employs a reservoir to contain the drug formulation, a nanoporous membrane, and a drug formulation with an oil.