Patents by Inventor Edward Iwamiya

Edward Iwamiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMI shielding techniques using multiple EMI shields which share the same circuit board holes
    Patent number: 7280368
    Abstract: A circuit board module includes a circuit board defining a top side, a bottom side and holes extending through the circuit board between the top and bottom sides. The module further includes a component mounted to a portion of the circuit board, and an EMI shield assembly configured to provide EMI shielding on the circuit board. The EMI shield assembly includes a top shield and a bottom shield. The top and bottom shields are configured to substantially enclose the portion of the circuit board and the component to provide EMI shielding when (i) contacts of the top shield insert into the holes defined by the circuit board in a first direction from the top side toward the bottom side, and (ii) contacts of the bottom shield simultaneously insert into the same holes defined by the circuit board in a second direction from the bottom side toward the top side.
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: October 9, 2007
    Assignee: Cisco Technology, Inc.
    Inventors: Edward Iwamiya, John Hanners
  • EMI shielding techniques using multiple EMI shields which share the same circuit board holes
    Publication number: 20070081311
    Abstract: A circuit board module includes a circuit board defining a top side, a bottom side and holes extending through the circuit board between the top and bottom sides. The module further includes a component mounted to a portion of the circuit board, and an EMI shield assembly configured to provide EMI shielding on the circuit board. The EMI shield assembly includes a top shield and a bottom shield. The top and bottom shields are configured to substantially enclose the portion of the circuit board and the component to provide EMI shielding when (i) contacts of the top shield insert into the holes defined by the circuit board in a first direction from the top side toward the bottom side, and (ii) contacts of the bottom shield simultaneously insert into the same holes defined by the circuit board in a second direction from the bottom side toward the top side.
    Type: Application
    Filed: September 29, 2005
    Publication date: April 12, 2007
    Inventors: Edward Iwamiya, John Hanners