Patents by Inventor Edward J. Cerwonka

Edward J. Cerwonka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nickel electroplating solution and acetylenic compounds therefor
    Patent number: 5164069
    Abstract: An aqueous acid electroplating solution comprising nickel ions and one or more acetylenic compounds, specifically mono- and polyglyceryl ethers of acetylenic alcohols; acetylenic compounds useful in the electroplating solution; and processes using such solution and compounds. The invention is particularly useful for nickel plating an irregular surface such as a printed circuit board having through-holes.
    Type: Grant
    Filed: November 5, 1990
    Date of Patent: November 17, 1992
    Assignee: Shipley Company Inc.
    Inventor: Edward J. Cerwonka
  • Additive for acid-copper electroplating baths to increase throwing power
    Patent number: 5051154
    Abstract: The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.
    Type: Grant
    Filed: January 29, 1990
    Date of Patent: September 24, 1991
    Assignee: Shipley Company Inc.
    Inventors: Roger F. Bernards, Gordon Fisher, Wade Sonnenberg, Edward J. Cerwonka, Stewart Fisher