Patents by Inventor Edward J. Derian
Edward J. Derian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7881072Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.Type: GrantFiled: August 11, 2006Date of Patent: February 1, 2011Assignee: Molex IncorporatedInventors: Joseph Ted Dibene, II, David H. Hartke, Carl E. Hoge, Edward J. Derian
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Publication number: 20100325882Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.Type: ApplicationFiled: June 30, 2010Publication date: December 30, 2010Applicant: Molex IncorporatedInventors: Joseph Ted DiBene, II, David H. Hartke, Carl E. Hoge, Edward J. Derian
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Patent number: 7167379Abstract: An assembly includes an electronic assembly with a microprocessor coupled to a power conversion assembly via a compliant conductor assembly. The compliant conductor assembly includes a plurality of spring conductors mounted in a carrier. Selected ones of the spring conductors are electromagnetically coupled with others of the spring conductors. Additionally, each spring conductor provides multiple conductive paths.Type: GrantFiled: April 30, 2003Date of Patent: January 23, 2007Inventors: Joseph T. DiBene, II, Edward J. Derian
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Patent number: 6847529Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.Type: GrantFiled: December 20, 2001Date of Patent: January 25, 2005Assignee: INCEP Technologies, Inc.Inventors: Joseph Ted Dibene, II, David H. Hartke, Carl E. Hoge, Edward J. Derian
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Patent number: 6801431Abstract: The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device mounted on a substrate, and a power interconnect assembly. The power conditioning circuit board includes a first side thermally coupled to the heat dissipating device, a power conditioning circuit for producing a conditioned power signal, and an aperture. The power dissipating device has a top surface thermally coupled to the heat dissipation device through an aperture. The substrate includes at least one power conductor disposed proximate at least one of the edges of the substrate. The power interconnection assembly, which electrically couples the conditioned power signal to the substrate and provides substantially all power to the substrate, includes an edge connector assembly removably coupled to the at least one edge of the substrate.Type: GrantFiled: November 8, 2002Date of Patent: October 5, 2004Assignee: Incep Technologies, Inc.Inventors: David J Hartke, Joseph T. Dibene, II, Edward J. Derian, James M. Broder
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Publication number: 20040043644Abstract: A method, apparatus, and article of manufacture for distributing power to electronic circuits. The apparatus can include one or more power arrays and one or more ground arrays. The power arrays and the ground arrays are located within a single housing. Some embodiments further distribute signals to the electronic circuits. The arrays can be arranged in a linear or coaxial configuration.Type: ApplicationFiled: May 27, 2003Publication date: March 4, 2004Inventors: J. Ted DiBene, Edward J. Derian
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Publication number: 20030214800Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.Type: ApplicationFiled: March 25, 2003Publication date: November 20, 2003Inventors: Joseph Ted Dibene, David H. Hartke, Carl E. Hoge, Edward J. Derian
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Publication number: 20030183406Abstract: An assembly includes an electronic assembly with a microprocessor coupled to a power conversion assembly via a compliant conductor assembly. The compliant conductor assembly includes a plurality of spring conductors mounted in a carrier. Selected ones of the spring conductors are electromagnetically coupled with others of the spring conductors. Additionally, each spring conductor provides multiple conductive paths.Type: ApplicationFiled: April 30, 2003Publication date: October 2, 2003Inventors: Joseph T. DiBene, Edward J. Derian
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Patent number: 6623279Abstract: A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the first conductive member, the second conductive member including a second conductor member first end and a second conductor member second end distal from the second conductor member first end; and one or more first circuit board permanent attachment features for electrical coupling with the first circuit board and second circuit board, and one or more disconnectable conduction features for electrically coupling the connector with the second circuit board.Type: GrantFiled: April 25, 2002Date of Patent: September 23, 2003Assignee: Incep Technologies, Inc.Inventors: Edward J. Derian, Joseph Ted DiBene, II, David H. Hartke
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Patent number: 6618268Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface.Type: GrantFiled: March 8, 2001Date of Patent: September 9, 2003Assignee: Incep Technologies, Inc.Inventors: Joseph T. Dibene, II, David H. Hartke, Edward J. Derian, Carl E. Hoge, James M. Broder, Jose B. San Andres, Joseph S. Riel
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Patent number: 6556455Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.Type: GrantFiled: October 30, 2001Date of Patent: April 29, 2003Assignee: Incep Technologies, Inc.Inventors: Joseph T. Dibene, II, David H. Hartke, Carl E. Hoge, Edward J. Derian
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Publication number: 20030057548Abstract: The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device mounted on a substrate, and a power interconnect assembly. The power conditioning circuit board includes a first side thermally coupled to the heat dissipating device, a power conditioning circuit for producing a conditioned power signal, and an aperture. The power dissipating device has a top surface thermally coupled to the heat dissipation device through an aperture. The substrate includes at least one power conductor disposed proximate at least one of the edges of the substrate. The power interconnection assembly, which electrically couples the conditioned power signal to the substrate and provides substantially all power to the substrate, includes an edge connector assembly removably coupled to the at least one edge of the substrate.Type: ApplicationFiled: November 8, 2002Publication date: March 27, 2003Applicant: INCEP Technologies, Inc.Inventors: David H. Hartke, Joseph Ted Dibene, Edward J. Derian, James M. Broder
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Publication number: 20030002268Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.Type: ApplicationFiled: December 20, 2001Publication date: January 2, 2003Inventors: Joseph Ted Dibene, David H. Hartke, Carl E. Hoge, Edward J. Derian
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Publication number: 20020176229Abstract: A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the first conductive member, the second conductive member including a second conductor member first end and a second conductor member second end distal from the second conductor member first end; and one or more first circuit board permanent attachment features for electrical coupling with the first circuit board and second circuit board, and one or more disconnectable conduction features for electrically coupling the connector with the second circuit board.Type: ApplicationFiled: April 25, 2002Publication date: November 28, 2002Applicant: INCEP Technologies, Inc.Inventors: Edward J. Derian, Joseph Ted DiBene, David H. Hartke
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Publication number: 20020114129Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.Type: ApplicationFiled: October 30, 2001Publication date: August 22, 2002Inventors: Joseph T. Dibene, David H. Hartke, Carl E. Hoge, Edward J. Derian
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Patent number: 6352482Abstract: A golf club (20) with an internal hosel (38), a shaft (40) and a hosel liner (50) is disclosed herein. The hosel liner (50) reduces axial stress on the shaft (40) during impact of the golf club (20) with a golf ball. The hosel liner (50) is preferably composed of a polycarbonate material that has a flexural modulus in the range of 300,000 pounds per square inch to 1,000,000 pounds per square inch. Preferably, the golf club head (22) has a large volume, greater than 300 cubic centimeters, and weighs less than 215 grams. Preferably, the shaft (40) is composed of graphite and weighs between 40 grams to 80 grams.Type: GrantFiled: August 31, 2000Date of Patent: March 5, 2002Assignee: Callaway Golf CompanyInventors: Daniel R. Jacobson, Herbert Reyes, Ronald K. Hettinger, J. Andrew Galloway, Paul D. Zanolli, Andrew J. Goodjohn, Peter L. Soracco, Edward J. Derian
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Publication number: 20020015288Abstract: ? A thermal mechanical interface usable between a heatsink and a heat dissipating device is disclosed. In one embodiment, the thermal mechanical interface comprises a thermally conductive mechanically resilient member having a corrugated cross section and a first thermal conductance, disposed between the heat sink and the heat dissipating device and a thermal interface material having a second thermal conductance, disposed within the corrugated cross section.Type: ApplicationFiled: July 20, 2001Publication date: February 7, 2002Inventors: Joseph T. Dibene, David H. Hartke, Wendell C. Johnson, Farhad Raiszadeh, Edward J. Derian, Jose B. San Andres
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Publication number: 20010036066Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface.Type: ApplicationFiled: March 8, 2001Publication date: November 1, 2001Inventors: Joseph T. Dibene, David H. Hartke, Edward J. Derian, Carl E. Hoge, James M. Broder, Jose B. San Andres, Joseph S. Riel
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Publication number: 20010033476Abstract: A method, apparatus, and article of manufacture for transferring heat is disclosed. The apparatus comprises a first thermally conductive plate; a second thermally conductive plate; and an angularly corrugated member disposed between and in thermal communication first thermally conductive plate and the second thermally conductive plate. The angularly corrugated member has a contiguous periodically repeating cross section which includes a first cross section segment, disposable substantially parallel to and in thermal communication with the first thermally conductive plate, a second cross section segment, disposable substantially parallel to and in thermal communication with the second thermally conductive plate, and a third cross section segment, communicatively coupled to the first surface and the second surface, wherein the third cross section segment forming an angle with the first thermally conductive plate.Type: ApplicationFiled: March 2, 2001Publication date: October 25, 2001Inventors: Joseph T. Dibene, David H. Hartke, Wendell C. Johnson, Edward J. Derian