Patents by Inventor Edward J. Hubbell

Edward J. Hubbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6945844
    Abstract: A saw cutting pattern is dynamically established for a semiconductor dicing saw based on detection of the saw blade contacting a wafer or a portion of a wafer. The dynamic cutting pattern may terminate cuts if the saw blade no longer contacts the wafer or a portion of a wafer. Thus, irregular shaped wafers may be cut without requiring that an entire predefined cutting pattern be carried out and/or without previously mapping the shape of the wafer or portion of a wafer. A map of the wafer or a portion of a wafer may also be generated based on the detection of the saw blade contacting the wafer during a first cutting pass and may be used during a second cutting pass.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: September 20, 2005
    Assignee: Cree, Inc.
    Inventor: Edward J. Hubbell, III
  • Publication number: 20040029491
    Abstract: A saw cutting pattern is dynamically established for a semiconductor dicing saw based on detection of the saw blade contacting a wafer or a portion of a wafer. The dynamic cutting pattern may terminate cuts if the saw blade no longer contacts the wafer or a portion of a wafer. Thus, irregular shaped wafers may be cut without requiring that an entire predefined cutting pattern be carried out and/or without previously mapping the shape of the wafer or portion of a wafer. A map of the wafer or a portion of a wafer may also be generated based on the detection of the saw blade contacting the wafer during a first cutting pass and may be used during a second cutting pass.
    Type: Application
    Filed: June 27, 2003
    Publication date: February 12, 2004
    Inventor: Edward J. Hubbell