Patents by Inventor Edward J. Kudrak, Jr.
Edward J. Kudrak, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160032479Abstract: Electrolytic plating compositions and electrolytic plating processes for the co-deposition of silver or silver alloy with fluoropolymer nanoparticles are provided. The silver or silver alloy composite coating containing fluoropolymer nanoparticles has enhanced functional properties such as a reduced coefficient of friction. The electrolytic plating composition comprises: (a) a silver ion source comprising silver methane sulfonate (Ag-MSA); (b) a complexing agent comprising a compound comprising a nitrogen-containing heterocyclic ring; (c) a pre-mix dispersion comprising fluoropolymer nanoparticles particles having a mean particle size of from about 10 nm and about 500 nm and a surfactant; and (d) an auxiliary surfactant comprising a cationic fluorosurfactant, wherein the composition has a pH of from about 8 to about 14.Type: ApplicationFiled: March 14, 2014Publication date: February 4, 2016Applicant: ENTHONE INC.Inventors: Jingye Li, Joseph A. Abys, Edward J. Kudrak, JR.
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Patent number: 9217205Abstract: A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.Type: GrantFiled: December 10, 2008Date of Patent: December 22, 2015Assignee: Enthone Inc.Inventors: Joseph A. Abys, Edward J. Kudrak, Jr., Jingye Li, Chen Xu, Chonglun Fan
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Patent number: 9175400Abstract: A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217° C. followed by cooling to a temperature between about 20° C. and about 28° C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.Type: GrantFiled: October 28, 2009Date of Patent: November 3, 2015Assignee: Enthone Inc.Inventors: Yung-Herng Yau, Xingping Wang, Cai Wang, Robert Farrell, Pingping Ye, Edward J. Kudrak, Jr., Karl F. Wengenroth, Joseph A. Abys
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Patent number: 8906217Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.Type: GrantFiled: July 24, 2012Date of Patent: December 9, 2014Assignee: Enthone Inc.Inventors: Joseph A. Abys, Jingye Li, Edward J. Kudrak, Jr., Chen Xu
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Patent number: 8741390Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.Type: GrantFiled: April 18, 2008Date of Patent: June 3, 2014Assignee: Enthone Inc.Inventors: Joseph A. Abys, Shenliang Sun, Chonglun Fan, Edward J. Kudrak, Jr., Cai Wang
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Publication number: 20120285834Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.Type: ApplicationFiled: July 24, 2012Publication date: November 15, 2012Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Jingye Li, Edward J. Kudrak, JR., Chen Xu
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Patent number: 8226807Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.Type: GrantFiled: October 20, 2008Date of Patent: July 24, 2012Assignee: Enthone Inc.Inventors: Joseph A. Abys, Jingye Li, Edward J. Kudrak, Jr., Chen Xu
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Publication number: 20110097597Abstract: A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217° C. followed by cooling to a temperature between about 20° C. and about 28° C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.Type: ApplicationFiled: October 28, 2009Publication date: April 28, 2011Applicant: ENTHONE INC.Inventors: Yung-Herng Yau, Xingping Wang, Cai Wang, Robert Farrell, Pingping Ye, Edward J. Kudrak, JR., Karl F. Wengenroth, Joseph A. Abys
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Patent number: 7883738Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an aromatic heterocycle comprising nitrogen; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.Type: GrantFiled: April 18, 2007Date of Patent: February 8, 2011Assignee: Enthone Inc.Inventors: Joseph A. Abys, Shenliang Sun, Chonglun Fan, Edward J. Kudrak, Jr.
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Publication number: 20100319572Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a substrate comprising a copper or copper alloy surface. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; a nitrogen-containing organic compound selected from the group consisting of primary amine, secondary amine, tertiary amine, and aromatic heterocycle comprising nitrogen; and an alcohol.Type: ApplicationFiled: June 18, 2008Publication date: December 23, 2010Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Shenliang Sun, Edward J. Kudrak, JR., Katrin Zschintzsch, Theodore Antonellis
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Publication number: 20100294669Abstract: A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.Type: ApplicationFiled: December 10, 2008Publication date: November 25, 2010Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Edward J. Kudrak, JR., Jingye Li, Chen Xu, Chonglun Fan
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Publication number: 20100151263Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.Type: ApplicationFiled: April 18, 2008Publication date: June 17, 2010Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Shenliang Sun, Chonglun Fan, Edward J. Kudrak, JR., Cai Wang
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Publication number: 20090145764Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.Type: ApplicationFiled: December 11, 2007Publication date: June 11, 2009Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Jingye Li, Edward J. Kudrak, JR., Chen Xu
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Publication number: 20090145765Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.Type: ApplicationFiled: October 20, 2008Publication date: June 11, 2009Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Jingye Li, Edward J. Kudrak, JR., Chen Xu
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Patent number: 5360991Abstract: A packaged device with a lead frame, a lead frame and an article of manufacture comprising a base metal, a layer of nickel on the base metal, and a protective composite of metal layers on the nickel. The composite includes, in succession from the nickel layer, a layer of palladium or soft gold strike, a layer of palladium-nickel alloy, a layer of palladium and a layer of gold. The palladium or soft gold strike layer acts primarily as a bonding (an adhesive) layer between the Ni and Pd-Ni alloy layers and as a layer that enhances reduction in porosity of subsequent layers, Pd-Ni alloy layer acts as a trap for base metal ions, Pd layer acts as a trap for Ni ions from the Pd-Ni alloy layer, and the outer gold layer synergistically enhances the quality to the Pd layer. The various layers are in thickness sufficient to effectively accomplish each of their designated roles, depending on the processing and use conditions.Type: GrantFiled: July 29, 1993Date of Patent: November 1, 1994Assignee: AT&T Bell LaboratoriesInventors: Joseph A. Abys, Igor V. Kadija, Edward J. Kudrak, Jr., Joseph J. Maisano, Jr.
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Patent number: 4911799Abstract: A process for electroplating palladium containing deposits from baths comprising a combination of a surfactant and a brightener combination. The surfactant is an alkyl, ammonium-type salt containing 4 to 35 carbon atoms. The brightener is 0-benzaldehydesulfonic acid, 1-naphthalene sulfonic acid, 2-naphthalenesulfonic acid, benzenesulfinic acid, oxy-4,4-bis (benzene) sulfinic acid, p-toluene sulfinic acid, 3-trifluoromethyl benzene sulfinic acid, allyl phenyl sulfone, 0-benzoic sulfamide, benzylsulfonyl propionamide, phenylsulfonyl acetamide, 3-(phenylsulfonyl) propionamide, benzene sulfonamide, bis (phenylsulfonyl) methane, guanidine carbonate, sulfaguanidine or nicotinic acid. This combination provides deposits having superior adhesion and ductility.Type: GrantFiled: August 29, 1989Date of Patent: March 27, 1990Assignee: AT&T Bell LaboratoriesInventors: Joseph A. Abys, Vijay Chinchankar, Virginia T. Eckert, Igor V. Kadija, Edward J. Kudrak, Jr., Joseph J. Maisano, Jr., Heinrich K. Straschil