Patents by Inventor Edward J. Leech
Edward J. Leech has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5178988Abstract: Compositions which include an acidified epoxy oligomer, a free radical photoinitiator and a monomer capable of being polymerized by the photoinitiator are used to form aqueous developable, photodefined coatings useful as permanent solder marks for printed circuits and permanent plating resists for additive printed wiring boards. The process for using the compositions include application as a fluid in solvents; drying; exposing to ultraviolet light; developing in an aqueous alkaline solution; and crosslinking the acidified, epoxy oligomers. The articles produced include printed wiring boards with the permanent, photoimaged resist composition thereon.Type: GrantFiled: July 29, 1991Date of Patent: January 12, 1993Assignee: Amp-Akzo CorporationInventors: Edward J. Leech, Steven M. Johnson
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Patent number: 5070002Abstract: Compositions which include an acidified epoxy oligomer, a free radical photoinitiator and a monomer capable of being polymerized by the photoinitiator are used to form aqueous developable, photodefined coatings useful as permanent solder marks for printed circuits and permanent plating resists for additive printed wiring boards.The process for using the compositions include application as a fluid in solvents; drying; exposing to ultraviolet light; developing in an aqueous alkaline solution; and crosslinking the acidified, epoxy oligomers. The articles produced include printed wiring boards with the permanent, photoimaged resist composition thereon.Type: GrantFiled: August 11, 1989Date of Patent: December 3, 1991Assignees: Amp-Akzo Corporation, Haven CorporationInventors: Edward J. Leech, Steven M. Johnson
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Patent number: 4981725Abstract: Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including a compound or combination of compounds containing an element which in one of its states is catalytically active to electroless metal deposition thereby adsorbing on the surface in situ the elemnt(s) and/or compound(s); thereafter treating the surface with a second medium to decrease the solubility of the compound or combination of compounds and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said element(s) into a catalytically-active state.Type: GrantFiled: February 21, 1978Date of Patent: January 1, 1991Assignee: AMP-Akzo CorporationInventors: Francis J. Nuzzi, Edward J. Leech, Richard W. Charm, Joseph Polichette
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Patent number: 4748056Abstract: Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including a compound or combination of compounds containing an element which in one of its states is catalytically active to electroless metal deposition thereby adsorbing on the surface in situ the element(s) and/or compound(s); thereafter treating the surface with a second medium to decrease the solubility of the compound or combination of compounds and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said element(s) into a catalytically-active state.Type: GrantFiled: February 21, 1978Date of Patent: May 31, 1988Assignee: Kollmorgen CorporationInventors: Francis J. Nuzzi, Edward J. Leech, Richard W. Charm, Joseph Polichette
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Patent number: 4662944Abstract: Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including cuprous ions and stannous ions thereby absorbing on the surface in situ at least said cuprous ions; thereafter treating the surface with a second medium to decrease the solubility of the cuprous ions and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said cuprous ions into a catalytically-active state.Type: GrantFiled: December 22, 1976Date of Patent: May 5, 1987Assignee: Kollmorgen Technologies CorporationInventors: Francis J. Nuzzi, Edward J. Leech, Richard W. Charm, Joseph Polichette
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Patent number: 4551488Abstract: A resinous protective coating useful in adhering plastics to metallic substrates. The protective coating is particularly useful as a solder mask and in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating, upon being subjected to heat, goes from a liquid or soft "gel-like" state into a solid phase without bleeding. The protective coating is resistant to copper, nickel and gold electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.Type: GrantFiled: June 29, 1984Date of Patent: November 5, 1985Assignee: Kollmorgen Technologies CorporationInventors: Edward J. Leech, Frank D. Russo
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Patent number: 4522850Abstract: New polymeric substrates for the electroless deposition of metal thereon. The substrates of the invention result from the polymerization of liquid mixtures comprising a liquid precursor of a polymer that is relatively susceptible to oxidative attack and a liquid precursor of a polymer that resists oxidation.Type: GrantFiled: April 5, 1982Date of Patent: June 11, 1985Assignee: Kollmorgen Technologies CorporationInventor: Edward J. Leech
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Patent number: 4510276Abstract: A resinous protective coating useful in adhering plastics to metallic substrates. The protective coating is particularly useful as a solder mask and in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating, upon being subjected to heat, goes from a liquid or soft "gel-like" state into a solid phase without bleeding. The protective coating is resistant to copper, nickel and gold electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.Type: GrantFiled: December 14, 1979Date of Patent: April 9, 1985Assignee: Kollmorgen Technologies CorporationInventors: Edward J. Leech, Frank D. Russo
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Patent number: 4504607Abstract: A resinous protective coating useful in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating upon being subjected to heat goes from a high viscosity solution to a gel and then to a solid or from a soft "gel-like" state into a solid. The protective coating is resistant to copper electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.Type: GrantFiled: July 22, 1982Date of Patent: March 12, 1985Assignee: Kollmorgen Technologies CorporationInventor: Edward J. Leech
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Patent number: 4486466Abstract: A resinous protective coating useful in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating upon being subjected to heat goes from a high viscosity solution to a gel and then to a solid or from a soft "gel-like" state into a solid. The protective coating is resistant to copper electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.Type: GrantFiled: July 29, 1982Date of Patent: December 4, 1984Assignee: Kollmorgen Technologies CorporationInventors: Edward J. Leech, Frank D. Russo
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Patent number: 4450190Abstract: Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with an activatable complex of copper in a liquid medium formed from a solution comprising a mixture of halogen, cuprous and cupric components and thereafter forming a deposit on the treated article surfaces of a water-insoluble derivative of the said complex. Such surface deposits are treated with a reducing agent or water to enhance their reception of metal in an electroless metal deposition bath.Type: GrantFiled: October 1, 1979Date of Patent: May 22, 1984Assignee: Kollmorgen Technologies CorporationInventors: Francis J. Nuzzi, Edward J. Leech, Richard W. Charm, Joseph Polichette
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Patent number: 4287253Abstract: Improved catalytic fillers result from the use of hydrazine to render reducible metal salts absorbed on filler material surfaces catalytic to the deposition of electroless metal. Use of such catalytic fillers in forming insulated articles in which holes are made lead to improved electroless metallization of the barrels of such holes.Type: GrantFiled: April 8, 1975Date of Patent: September 1, 1981Assignee: Photocircuits Division of Kollmorgen Corp.Inventor: Edward J. Leech
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Patent number: 4259113Abstract: Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with a liquid containing an activatable complex of copper. The copper-containing complexes of the instant invention are the product of forming solutions comprising a halogen component, a cuprous component and a cupric component. The solutions may optionally be in contact with elemental metal.Type: GrantFiled: February 21, 1978Date of Patent: March 31, 1981Assignee: Kollmorgen Technologies CorporationInventors: Francis J. Nuzzi, Edward J. Leech, Richard W. Charm, Joseph Polichette
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Patent number: 4199623Abstract: Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with an activatable complex of copper in a liquid medium formed from a solution comprising a mixture of halogen, cuprous and cupric components and thereafter forming a deposit on the treated article surfaces of a water-insoluble derivative of the said complex. Such surface deposits are treated with a reducing agent or water to enhance their reception of metal in an electroless metal deposition bath.Type: GrantFiled: May 13, 1977Date of Patent: April 22, 1980Assignee: Kollmorgen Technologies CorporationInventors: Francis J. Nuzzi, Edward J. Leech, Richard W. Charm, Joseph Polichette
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Patent number: 4073740Abstract: Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of manganate to permanganate being up to about 1.2 and the composition having a pH controlled in the range of 11 to 13. Means to regenerate the composition and a temperature controlled in the range of 20.degree. C. to 100.degree. C. are also described.Type: GrantFiled: February 28, 1977Date of Patent: February 14, 1978Assignee: Kollmorgen Technologies CorporationInventors: Joseph Polichette, Edward J. Leech, John G. Branigan
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Patent number: 4054693Abstract: Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of manganate to permanganate being up to about 1.2 and the composition having a pH controlled in the range of 11 to 13. Resinous surfaces so treated are neutralized in a process including treatment with hydrazine in order to yield metallized resinous surfaces exhibiting superior peel strengths following electroless metal deposition.Type: GrantFiled: July 9, 1975Date of Patent: October 18, 1977Assignee: Kollmorgen Technologies CorporationInventors: Edward J. Leech, Joseph Polichette, John G. Branigan
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Patent number: 4042729Abstract: Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of manganate to permanganate being up to about 1.2 and the composition having a pH controlled in the range of 11 to 13. Means to regenerate the composition and a temperature controlled in the range of 20.degree. to 100.degree. C are also described.Type: GrantFiled: June 18, 1975Date of Patent: August 16, 1977Assignee: Kollmorgen Technologies CorporationInventors: Joseph Polichette, Edward J. Leech, John G. Branigan
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Patent number: 3994727Abstract: Non-conductive real images are formed on substrates by depositing reducible metal salt compositions thereon from an aqueous acidic solution of pH 1.5-5 containing bromide ions and exposing the coated substrates to radiant energy to reduce the metal salt to metallic nuclei and to produce a real image of metal, which is intensified and built up by electroless metal deposition. The metal salt composition can either be selectively deposited and then exposed, or uniformly deposited and then selectively exposed, to produce the real image.Type: GrantFiled: July 11, 1974Date of Patent: November 30, 1976Assignee: Photocircuits Divison of Kollmorgen CorporationInventors: Joseph Polichette, Edward J. Leech
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Patent number: 3993802Abstract: Sensitizing processes and the resulting new articles of manufacture, suitable for the production of metallized bodies, such as printed circuits, dials, nameplates, metallized plastics, glass, ceramics and the like, comprising bases coated with a halide containing aqueous sensitizing solution of pH 1.5-4.0 that deposits a layer of copper, nickel, cobalt or iron salts or salt compositions, which on exposure to radiant energy, such as heat, light, etc., is converted to a layer of metal nuclei which is non-conductive, but which is capable of catalyzing the deposition of metal onto the base from an electroless metal deposition solution in contact with the metal nuclei.Type: GrantFiled: July 11, 1974Date of Patent: November 23, 1976Assignee: Photocircuits Division of Kollmorgen CorporationInventors: Joseph Polichette, Edward J. Leech, Francis J. Nuzzi
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Patent number: 3962496Abstract: A new composition and method for treating resinous surfaces that are to be metallized, and an improved sensitized substrate resulting therefrom. A resinous surface that has been conditioned by an oxidizer is treated with an aqueous solution comprising hydrazine to neutralize the surface and provide an improved sensitized surface for subsequent metallization. A preferred form of the solution also includes a pH adjuster and a sequestering agent.Type: GrantFiled: November 7, 1974Date of Patent: June 8, 1976Assignee: Photocircuits Division of KollmorgenInventor: Edward J. Leech