Abstract: A method of packaging image sensors using an optical grade adhesive and cover plate over the image sensor.

Abstract: A method of precisely aligning and fastening a glass cover plate over an image sensor includes the use of first and second sets of spacers arranged so that the glass cover plate is provided on the base plate and the image sensor is provided on the first set of spacers and spaced from a carrier mounted on the second set of spacers. An adhesive secures the glass cover plate to the image sensor as well as the image sensor to the carrier.

Abstract: A method of producing a package for an image sensor using several applications of adhesive and a glass cover plate is set forth.

Abstract: Apparatus and a method for the packaging of semiconductor chips to simplify assembly while improving thermal dissipation from the chip and reducing stress in the chip due to differential thermal expansion between the chip and its package as they are cycled over a temperature range are disclosed. An adhesive tape covers an active area of the chip and leaving bonding pads on the chip exposed through a recess in the adhesive tape. A body with a similar recess supports the other side of the tape. Wire bonds are made in the recess to connect bonding pads on the body to the chip. A lid covers the recess to protect the wire bonds.

Abstract: A method for bonding a color separation filter to an image sensor. The method comprises the steps of dispensing an optical coupling composition on a preselected surface of at least one of the filter and sensor; bonding the filter to the sensor for creating a filter-sensor assembly, by using a predetermined amount of UV curable adhesive at an interface of the filter-sensor assembly; and, dispensing an epoxy along a periphery of the filter-sensor assembly, thereby encapsulating the optical coupling composition at the interface of the filter-sensor assembly.

Abstract: A hermetically sealed package for a microelectronic device, such as a solid-state image sensor, includes a ceramic housing defining a cavity in a major surface thereof and metal terminals extending through side edges thereof to the cavity. A microelectronic device is in the cavity and electrically connected to the terminals. A cover plate extends over the cavity and over a portion of the major surface around the cavity. An amalgam of a mixture of a liquid metal and a powdered metal is between the cover plate and the housing surface. The amalgam bonds the cover plate to the housing and forms a hermetical seal therebetween.

Abstract: A system, including a method and cognate apparatus, places an object on a carrier with great accuracy. Three prepositioned pins on a holder engage a corner portion of the carrier formed between adjacent side edges of the carrier to provide the corner in a predetermined fixed relation to the stops. Two prepositioned spaced target points at predetermined locations on the object are aligned in a predetermined orientation with the pins and thus with the adjacent side edges of the carrier, enabling the object to be placed on the carrier in precise manner. A sensing and placing mechanism, such as a camera, vision system and micropositioning table, senses the pin positions on the holder and target point positions on the object. The object is placed on the carrier in dependence upon the sensed pin and target point positions such that each target point is in a preselected position relative to the pins and pin engaged corner of the carrier.

Abstract: The present invention relates to a solid state assembly having a solid state device bonded to a terminal board of an insulating material having a plurality of metal terminal pads thereon and arranged in a pattern. A metal bump is on each of the terminal pads of the terminal plate with an amalgam layer covering at least a top of each bump. The solid state device has a plurality of metal terminal pads thereon. The solid state device is mounted on the terminal board with each of its terminal pads being seated on the amalgam of each bump on the terminal board. The assembly is formed by placing some amalgam on each of the bumps on the terminal plate. The solid state device is then mounted on the terminal plate and the amalgam is hardened, such as by heating at a low temperature, to bond the amalgam to the bumps and the solid state device terminal plates.

Abstract: A method and apparatus for forming a solid preform body of an amalgam from a thin layer of the amalgam comprises a base plate on which the amalgam in liquid form is spread into a thin layer. The amalgam comprises a mixture of a liquid metal and a powdered metal. A first temperature is applied to the amalgam layer through the base plate. The first temperature may be lower than the melting temperature of the liquid metal in the amalgam to form a frozen solid layer of the amalgam, or may be above the melting temperature of the liquid metal to maintain the amalgam layer in liquid form. A second temperature is applied to a portion of the amalgam layer which is to form the preform body. If the first temperature is below the melting temperature of the liquid metal, the second temperature is above the melting temperature of the liquid metal to form a molten zone in the amalgam layer along the edge of the preform body so as to permit the body to be separated from the remaining portion of the amalgam layer.

Abstract: A modular image sensor array is disclosed which includes a plurality of tiles each of which has an image sensor mounted thereon. The tiles are mounted on a base plate such that the image sensors form a predetermined pattern. In order to precisely locate the tiles relative to each other and to provide for the replacement of defective tiles, the tiles are assembled in an interlocking pattern on the base plate. The top surface of the tiles is formed by ceramic plates, and electrical conductors for the image sensors are formed on one of the ceramic plates. A transparent cover is mounted over all of the image sensors in the array.

Abstract: A solid, thin sheet of an amalgam is formed by first mixing together a liquid metal and one or more powdered metals to form the amalgam in liquid form. The liquid amalgam is then spread out over a surface to form a thin layer of the liquid amalgam. The temperature of the thin layer of amalgam is then reduced to below the melting temperature of the liquid metal in the amalgam to form a solid sheet of the amalgam. The solid thin sheet of amalgam can then be removed from the surface. The solid thin sheet of amalgam can be stored at the lower temperature until it is desired to use the amalgam.

Abstract: The present invention relates to a preform of a solid body of an amalgam. The amalgam is a mixture of a metal which is liquid at room temperature and at least one powdered metal. The preform is formed by mixing together the ingredients of the amalgam and pouring the amalgam into a caity in a mold. The mold and amalgam is then cooled to a temperature below the melting temperature of the liquid metal in the amalgam. The preform is then removed from the mold. The preform can be stored at the low temperature until it is desired to use it to bond two bodies together. The preform can be used to bond two bodies together, such as the cover plate and housing of a microelectronic device package, by placing the preform between the two bodies. The bodies are mechanically scrubbed and clamped together with the preform therebetween and heated to a temperature at which the preform melts and the amalgam reacts to bond to the two bodies.

Abstract: A method of making a hermetic seal for a solid-state device is disclosed. The device includes a ceramic housing having a cavity for an element such as an image sensor. A cover formed of a transparent material is sealed to the housing to close the cavity. A metallization support is formed on the cover and on the housing. In order to form a hermetic seal at a relative low temperature, a layer of indium is coated on the metallization support of either the cover or the housing, and a layer of tin is coated on the support of the other of the two parts. The cover is then placed on the housing, and the parts are placed in a furnace where a temperature under the melting temperature of the composite alloy of tin and indium is maintained for a period long enough to diffuse the tin and indium together. The temperature is then raised to a temperature sufficient to melt the alloy, and the device is then slowly cooled to ambient temperature.