Patents by Inventor Edward James Conlon

Edward James Conlon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical feedthroughs for ceramic circuit board support substrates
    Patent number: 5681444
    Abstract: Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.
    Type: Grant
    Filed: July 3, 1996
    Date of Patent: October 28, 1997
    Assignee: David Sarnoff Research Center, Inc.
    Inventors: Thomas Peter Azzaro, Barry Jay Thaler, Edward James Conlon, Ananda Hosakere Kumar
  • Process for making electrical feedthroughs for ceramic circuit board support substrates
    Patent number: 5653834
    Abstract: Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.
    Type: Grant
    Filed: May 24, 1995
    Date of Patent: August 5, 1997
    Assignee: David Sarnoff Research Center, Inc.
    Inventors: Thomas Peter Azzaro, Barry Jay Thaler, Edward James Conlon, Ananda Hosakere Kumar
  • Wire placement fixture
    Patent number: 3972463
    Abstract: A microcircuit adhesion testing method and fixture for uniform placement and soldering of a preselected length of wire above a film pad on a microcircuit substrate with consistent substrate-to-wire spacing, comprising a holder for the substrate, finger spacers attached to the holder, and a member for pressing the wire against the spacers. The spacers are made of a material which is not wettable with solder of the type used to attach the wire to the film.
    Type: Grant
    Filed: February 7, 1975
    Date of Patent: August 3, 1976
    Assignee: RCA Corporation
    Inventors: Edward James Conlon, Ralph DeStephanis, Thomas Tipton Hitch