Abstract: A receptacle assembly includes a guide frame having a front end with an opening to an interior cavity of the guide frame. The front end is configured to receive a module assembly; and an EMI gasket is secured to an edge of the opening. The EMI gasket includes at least one conductive strap extending along a length of the edge, and the conductive strap covers a substantial majority of the edge to form a shielded EMI interface along the edge. A continuous conductive collar is provided on peripheral edges surrounding the opening. The collar is configured to form an uninterrupted and continuous EMI shielding interface with a bezel.

Abstract: A receptacle assembly includes a guide frame having a front end with an opening to an interior cavity of the guide frame. The opening is configured to receive a module assembly. The guide frame has a bottom with a bottom opening to the interior cavity, and the bottom is configured to be joined to a circuit board. An EMI gasket is provided along at least a portion of a perimeter of the bottom opening to be held between the guide frame and a circuit board. The EMI gasket forms a shielded interface along the portion of the perimeter of the bottom opening. Conductive straps are provided along the leading edge of the opening and have widths sufficient to cover a substantial majority of the leading edge to form a shielded interface along the leading edge. An EMI gasket including a skirt extending partially along a portion of the perimeter of the bottom opening is also provided.

Abstract: A receptacle assembly includes a guide frame having top, bottom and side walls joined to form an interior cavity configured to receive an electrical module. One of the top, bottom and side walls has an opening therethrough, and a heat sink is mounted over the opening. The heat sink has an engagement surface located proximate the interior cavity of the guide frame, and the engagement surface of the heat sink is configured to physically contact a module when installed in said interior cavity. The heat sink dissipates heat generated in the module and facilitates a data transmission rate of 10 Gbs through the assembly.

Abstract: A socket assembly (10) for an electronic package (2) comprises a base (20) which is mountable on a circuit board (8), and a separable subassembly (11) which houses the electronic package and is securable to the base with threaded fasteners (80). The subassembly (11) comprises an electronic package holder (30) mountable on the base (20), a heat sink (50) mountable on the holder, and polarizing pins (14) which are interference fitted between the holder and the heat sink. The holder has a topside (32), an underside (34) and a generally central opening (36) extending therebetween. The opening (36) is dimensioned to accommodate the package (2) and is formed with a seat (38) for the package such that leads (5) of the package will extend below the underside (34) for electrical connection with contacts in the base (20) when the package is supported on the seat. In a preferred embodiment, a shoulder member (40) which is configured as a frame resides in the opening of the holder and seats on a perimeter of the package.

Abstract: A socket is disclosed for a tape carrier package (10) having a plurality of leads (6) extending across an aperture (8) in a tape carrier (2). The socket includes a cover (14) having a tape mounting surface (44) and a plurality of ribs (30) protruding from the tape mounting surface. The ribs are arranged to extend through the aperture (8) and to straddle the leads (6) when the tape carrier package (10) is disposed on the tape mounting surface (44). The cover (14) is matable with a housing (12) holding a plurality of contacts (20). The ribs (30) straddle and guide the leads (6) into engagement with respective contacts (20) as the cover is mated with the housing. A socket for a tape carrier package (110) is also disclosed. The socket includes a cover (114) having a tape mounting surface including an undersurface (144) and an inclined surface (148).