Abstract: An interface for mitigating electromagnetic interference (EMI) on a printed circuit board (PCB) is disclosed. The PCB can contain circuit components and includes one or more signal planes sandwiched between corresponding ground planes. The PCB has a first and second side and an interface region separating the first and second sides that includes a partition wall projecting outward from the interface region, configured for EMI shielding between the first side and second sides, one or more pairs of input and output pads straddling the interface region on respective first and second sides and configured to accommodate an EMI line filter, and a ground barrier within the printed circuit board under the interface region. A method of mitigating EMI using the interface is also disclosed.

Abstract: Apparatus and associated methods are disclosed that relate to detecting a shaft condition of a gas turbofan engine. Shaft condition is detected based on sensed rotation rates of the shaft at different shaft locations. If the sensed rotations rates of the shaft at the two different shaft locations are indicative of a compromised shaft, such as, for example, a shaft that has sheared, then a fuel cut-off signal is generated. The fuel cut-off signal is then sent to a fuel cut-off valve so as to cut off the fuel supplied to the gas turbofan engine. In some embodiments, shaft condition is determined based on a difference between scaled rotation rates of the shaft at two different shaft locations.

Abstract: An interface for mitigating electromagnetic interference (EMI) on a printed circuit board (PCB) is disclosed. The PCB can contain circuit components and includes one or more signal planes sandwiched between corresponding ground planes. The PCB has a first and second side and an interface region separating the first and second sides that includes a partition wall projecting outward from the interface region, configured for EMI shielding between the first side and second sides, one or more pairs of input and output pads straddling the interface region on respective first and second sides and configured to accommodate an EMI line filter, and a ground barrier within the printed circuit board under the interface region. A method of mitigating EMI using the interface is also disclosed.

Abstract: A method of managing over-temperature excursions in an electronic control unit of a control system having failed-fixed capability and an operationally independent temperature monitoring and power enable function. The method includes receiving a temperature signal indicative of a temperature associated with an electronic control unit, determining if the temperature associated with the electronic control unit exceeds a first selected threshold, determining if the temperature associated with the electronic control unit exceeds a second selected threshold, and ascertaining if an engine associated with the control system is operational. The method also includes that if the engine is not operational and the temperature exceeds the first selected threshold, then disabling an actuator associated with the control system.

Abstract: A method of managing over-temperature excursions in an electronic control unit of a control system having failed-fixed capability and an operationally independent temperature monitoring and power enable function. The method includes receiving a temperature signal indicative of a temperature associated with an electronic control unit, determining if the temperature associated with the electronic control unit exceeds a first selected threshold, determining if the temperature associated with the electronic control unit exceeds a second selected threshold, and ascertaining if an engine associated with the control system is operational. The method also includes that if the engine is not operational and the temperature exceeds the first selected threshold, then disabling an actuator associated with the control system.

Abstract: A multi-channel control system includes a first primary control microprocessor and a second primary control microprocessor operable to control a device, and a first secondary control microprocessor and a second secondary control microprocessor operable to control the device. Each of the first and second primary control microprocessors and the first and second secondary control microprocessors are arranged as an independent control channel.

Abstract: A multi-channel controller uses multiple logic gates and multiple control channels to provide fault tolerant protection against undesired events.

Abstract: A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.

Abstract: A multi-channel controller uses multiple logic gates and multiple control channels to provide fault tolerant protection against undesired events.

Abstract: A multi-channel control system includes at least a first primary control microprocessor and a second primary control microprocessor operable to control a device, and at least a first secondary control microprocessor and a second secondary control microprocessor operable to control the device. Each of the first and second primary control microprocessors and the first and second secondary control microprocessors are arranged as an independent control channel.

Abstract: A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.