Abstract: A module is insertable within a fliptop unit for supporting any one of a variety of connectors that may be stored within the module. A front wall, rear wall, and pair of opposing sidewalls enclose an opening through the module. The pair of opposing sidewalls are disposed between the front wall and rear wall. An inner wall of one opposing sidewall includes mounting locations for receiving an end section of a pair of arms of a holder insert. The mounting locations correspond to a heights along the opening of the module. An inner wall of another opposing sidewall includes opposing mounting locations for receiving an end section of another arm of the holder insert. The opposing mounting locations further correspond to the heights along the opening of the module. The holder insert is mountable at any one of the heights along the opening of the module.

Abstract: A holder insert is insertable within a module of a fliptop unit for supporting a variety of connectors that may be stored in the module. A platform part has a first surface, an opposing second surface, and an aperture. A pair of arms located at opposite ends of the platform part each extend away from the platform part and have an end section that is mountable at a height within the module. A sleeve extends from the platform part and surrounds the aperture, extending its depth. At least one gap extends from an edge of the platform part to the aperture, and from the first surface to the second surface and at least part way along the sleeve. The holder insert is a single piece of elastic material. A load being placed on the holder insert deforms the holder insert and changes a width of the at least one gap.

Abstract: A fluid cooling system provides integrated fluid cooling to dissipate heat from a track busway system, particularly the busbars of a track busway system. The fluid cooling system for the track busway system includes one or more cooling jackets in thermal contact with the busbars of a section of the track busway system. A cooling fluid flows through the cooling jackets to remove or dissipate heat from the busbars of the track busway system through conductive heat transfer. In addition, section joints or busway joinders may receive separate fluid cooling from the fluid cooling system using a cooler positioned between the joint packs connecting the sections of the track busway system.

Abstract: A module is insertable within a fliptop unit for supporting any one of a variety of connectors that may be stored within the module. A front wall, rear wall, and pair of opposing sidewalls enclose an opening through the module. The pair of opposing sidewalls are disposed between the front wall and rear wall. An inner wall of one opposing sidewall includes mounting locations for receiving an end section of a pair of arms of a holder insert. The mounting locations correspond to a heights along the opening of the module. An inner wall of another opposing sidewall includes opposing mounting locations for receiving an end section of another arm of the holder insert. The opposing mounting locations further correspond to the heights along the opening of the module. The holder insert is mountable at any one of the heights along the opening of the module.

Abstract: A holder insert is insertable within a module of a fliptop unit for supporting a variety of connectors that may be stored in the module. A platform part has a first surface, an opposing second surface, and an aperture. A pair of arms located at opposite ends of the platform part each extend away from the platform part and have an end section that is mountable at a height within the module. A sleeve extends from the platform part and surrounds the aperture, extending its depth. At least one gap extends from an edge of the platform part to the aperture, and from the first surface to the second surface and at least part way along the sleeve. The holder insert is a single piece of elastic material. A load being placed on the holder insert deforms the holder insert and changes a width of the at least one gap.

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

Abstract: New wiring terminations and methods are disclosed. The terminations may be incorporated into any suitable device such as wiring device which comprises a housing having a plurality of wire terminations. At least one of the plurality of wire terminations comprises a conductive surface and an element. The conductive surface is at least partially disposed within the housing. The element is movably mounted at least partially within the housing and is tool-lessly movable between at least a first position and a second position. The first position of the element actuates the termination such that the termination receives a wire and the second position of the element actuates the termination to removably clamp the wire.

Abstract: New wiring terminations and methods are disclosed. The terminations may be incorporated into any suitable device such as wiring device which comprises a housing having a plurality of wire terminations. At least one of the plurality of wire terminations comprises a conductive surface and an element. The conductive surface is at least partially disposed within the housing. The element is movably mounted at least partially within the housing and is tool-lessly movable between at least a first position and a second position. The first position of the element actuates the termination such that the termination receives a wire and the second position of the element actuates the termination to removably clamp the wire.