Abstract: The present disclosure is directed generally to simultaneous dual-band systems and methods. A dual-band system as disclosed herein includes a plurality of pixels. Each pixel comprising a first absorber layer; a first intervening layer located adjacent the first absorber layer; a second absorber layer located adjacent to the first intervening layer; and a second intervening layer located adjacent to the second absorber layer. The plurality of pixels includes a first subset of pixels for detecting light in a first band and a second subset of pixels for detecting light in a second band. Carriers created in the first absorber layer of the first subset of pixels are collected via the first contact layer. Carriers created in the second absorber layer of the second subset of pixels are collected via the second contact layer and carriers created in the first absorber layer remain uncollected.

Abstract: Techniques are disclosed for facilitating interconnecting semiconductor devices. In one example, a method of interconnecting a first substrate to a second substrate is provided. The method includes forming a first plurality of contacts on the first substrate. The method further includes forming an insulative layer on the first substrate. The method further includes forming a second plurality of contacts on the second substrate. The method further includes joining the first plurality of contacts to the second plurality of contacts to form interconnects between the first substrate and the second substrate. When the first and second substrates are joined, at least a portion of each of the interconnects is surrounded by the insulative layer. Related systems and devices are also provided.

Abstract: A dual band photodetector includes a first band absorber layer is configured to absorb incident light in a first wavelength spectral band and a second band absorber layer configured to absorb incident light in a second wavelength spectral band. The dual band photodetector further includes an electron-photon blocking (EPB) layer located between the respective layers and includes at least one high band gap layer and at least one intervening layer. The difference in refractive index between the at least one high band gap layer and the at least one intervening layer form a distributed brag reflector (DBR) designed to reflect wavelengths corresponding with radiative recombination photons emitted from at least the first absorber layer to reduce optical crosstalk between the first band absorber layer and the second band absorber layer.

Abstract: Techniques are disclosed for facilitating multi-etch detector pixels fabrication. In one example, a method includes forming a semiconductor structure. The semiconductor structure includes a substrate layer, an absorber layer disposed on the substrate layer, a barrier layer disposed on the absorber layer, and a first contact layer disposed on the barrier layer. The method further includes forming the pixels from the semiconductor structure. The forming of the pixels includes performing a first etching operation to remove a portion of at least the first contact layer, and performing a second etching operation to remove a portion of the barrier layer and a portion of the absorber layer. Each of the pixels includes a respective portion of each of the substrate layer, the first contact layer, the barrier layer, and the absorber layer. Related systems and devices are also provided.

Abstract: Techniques are disclosed for facilitating interconnecting semiconductor devices. In one example, a method of interconnecting a first substrate to a second substrate is provided. The method includes forming a first plurality of contacts on the first substrate. The method further includes forming an insulative layer on the first substrate. The method further includes forming a second plurality of contacts on the second substrate. The method further includes joining the first plurality of contacts to the second plurality of contacts to form interconnects between the first substrate and the second substrate. When the first and second substrates are joined, at least a portion of each of the interconnects is surrounded by the insulative layer. Related systems and devices are also provided.

Abstract: Techniques are disclosed for facilitating detection of electromagnetic radiation using superlattice-based detector systems and methods. In one example, an infrared detector includes a first superlattice structure including first periods. Each of the first periods includes a first sub-layer and a second sub-layer adjacent to the first sub-layer. The first and second sub-layers include first and second semiconductor materials. The infrared detector further includes a second superlattice structure disposed on the first superlattice structure. The second superlattice structure includes second periods. Each of the second periods includes a third sub-layer and a fourth sub-layer adjacent to the third sub-layer. The third-sub-layer includes a third semiconductor material. The fourth sub-layer includes a fourth semiconductor material. A p-n junction is formed at an interface within the second superlattice structure or at an interface between the first and second superlattice structures.

Abstract: Techniques are disclosed for facilitating dual color detection. In one example, an imaging device includes a first pixel configured to detect first image data associated with a first waveband of electromagnetic radiation. The imaging device further includes a second pixel configured to detect second image data associated with a second waveband of the electromagnetic radiation, where at least a portion of the second waveband does not overlap the first waveband. The imaging device further includes a bias circuit configured to apply a first voltage between the first pixel and a first ground contact, and apply a second voltage between the second pixel and a second ground contact. The first voltage is different from the second voltage. Related methods are also provided.

Abstract: Materials and methods may be provided for short-wave infrared (SWIR) superlattice materials. The superlattice material includes a first sub-layer comprising InAs, and a second sub-layer adjacent to the first sub-layer including AlSb, AlAsSb, or InAlAsSb.

Abstract: Systems and methods may be provided for fabricating infrared focal plane arrays. The methods include providing a device wafer, applying a coating to the device wafer, mounting the device wafer to a first carrier wafer, thinning the device wafer while the device wafer is mounted to the first carrier wafer, releasing the device wafer from the first carrier wafer, singulating the device wafer into individual dies, each die having an infrared focal plane array, and hybridizing the individual dies to a read out integrated circuit.

Abstract: Systems and methods may be provided for fabricating infrared focal plane arrays. The methods include providing a device wafer, applying a coating to the device wafer, mounting the device wafer to a first carrier wafer, thinning the device wafer while the device wafer is mounted to the first carrier wafer, releasing the device wafer from the first carrier wafer, singulating the device wafer into individual dies, each die having an infrared focal plane array, and hybridizing the individual dies to a read out integrated circuit.

Abstract: Materials and methods may be provided for short-wave infrared (SWIR) superlattice materials. The superlattice material includes a first sub-layer comprising InAs, and a second sub-layer adjacent to the first sub-layer including AlSb, AlAsSb, or InAlAsSb.