Abstract: Systems and methods of forming a thin film on substrate includes positioning the substrate in a chamber; generating, via a uniform microwave field generator, a microwave field around the substrate; and guiding radicals into the chamber so that plasma is generated about the substrate to form the thin film on the substrate.

Abstract: A system and method for annealing a target substrate such as a semiconductor using industrial microwave heating and parallel plate reaction. Using a uniform microwave field, with the target substrate located between parallel plates controls application of eddy currents to the target substrate. The system may include a uniform microwave field generator, support elements, two plates held in parallel to each other, and a turntable device configured to rotate the two plates and the target substrate within the uniform microwave field. The rotating of the plates and target substrate in the uniform microwave field creates a periodic change in polarity of the microwaves applied to the target substrate. The eddy currents in the uniform microwave field react by flowing perpendicular to the plates, and not parallel to the surface as in traditional microwave reactions of metals. This redirection of the eddy currents provides even heating of the target substrate.

Abstract: Systems and methods of forming a thin film on substrate includes positioning the substrate in a chamber; generating, via a uniform microwave field generator, a microwave field around the substrate; and guiding radicals into the chamber so that plasma is generated about the substrate to form the thin film on the substrate.

Abstract: An apparatus for annealing semiconductor integrated circuit wafers comprises a microwave energy source and a reactor housing. The microwave energy source is configured to generate microwave radiation having a first wavelength. The reactor housing is configured to receive a plurality of semiconductor integrated circuit wafers simultaneously. The reactor housing includes a top wall, a bottom wall, a left side wall, a right side wall, a front wall, and a back wall connected to one another to form a box-shaped internal chamber. Each wall is electrically connected to electrical ground and is water cooled. The walls of the internal chamber are spaced apart such that the microwave radiation forms a single mode within the internal chamber.

Abstract: A system and method for annealing a target substrate such as a semiconductor using industrial microwave heating and parallel plate reaction. Using a uniform microwave field, with the target substrate located between parallel plates controls application of eddy currents to the target substrate. The system may include a uniform microwave field generator, support elements, two plates held in parallel to each other, and a turntable device configured to rotate the two plates and the target substrate within the uniform microwave field. The rotating of the plates and target substrate in the uniform microwave field creates a periodic change in polarity of the microwaves applied to the target substrate. The eddy currents in the uniform microwave field react by flowing perpendicular to the plates, and not parallel to the surface as in traditional microwave reactions of metals. This redirection of the eddy currents provides even heating of the target substrate.

Abstract: A system and method for annealing a target substrate such as a semiconductor using industrial microwave heating and parallel plate reaction. Using a uniform microwave field, with the target substrate located between parallel plates controls application of eddy currents to the target substrate. The system may include a uniform microwave field generator, support elements, two plates held in parallel to each other, and a turntable device configured to rotate the two plates and the target substrate within the uniform microwave field. The rotating of the plates and target substrate in the uniform microwave field creates a periodic change in polarity of the microwaves applied to the target substrate. The eddy currents in the uniform microwave field react by flowing perpendicular to the plates, and not parallel to the surface as in traditional microwave reactions of metals. This redirection of the eddy currents provides even heating of the target substrate.

Abstract: A system and method for annealing a target substrate such as a semiconductor using industrial microwave heating and parallel plate reaction. Using a uniform microwave field, with the target substrate located between parallel plates controls application of eddy currents to the target substrate. The system may include a uniform microwave field generator, support elements, two plates held in parallel to each other, and a turntable device configured to rotate the two plates and the target substrate within the uniform microwave field. The rotating of the plates and target substrate in the uniform microwave field creates a periodic change in polarity of the microwaves applied to the target substrate. The eddy currents in the uniform microwave field react by flowing perpendicular to the plates, and not parallel to the surface as in traditional microwave reactions of metals. This redirection of the eddy currents provides even heating of the target substrate.

Abstract: The present invention relates to a method for preparing a suspension for the encapsulation of heat and moisture sensitive substances in capsules, sachets, droplets and food compositions. It also relates to methods for encapsulating, to the encapsulated products and to methods for storing the encapsulated products. The invention is extremely suitable for the encapsulation of microbial cultures. Cultures encapsulated in capsules prepared according to the method of the invention, will stay stable for a long time. At 25 degrees C. they show a stability reduction of less than 1 log per month.

Abstract: A system for and method of processing, i.e., annealing semiconductor materials. By controlling the time, frequency, variance of frequency, microwave power density, wafer boundary conditions, ambient conditions, and temperatures (including ramp rates), it is possible to repair localized damage lattices of the crystalline structure of a semiconductor material that may occur during the ion implantation of impurities into the material, electrically activate the implanted dopant, and substantially minimize further diffusion of the dopant into the silicon. The wafer boundary conditions may be controlled by utilizing susceptor plates (4) or a water chill plate (12). Ambient conditions may be controlled by gas injection (10) within the microwave chamber (3).

Abstract: The present invention relates to a method for preparing a suspension for the encapsulation of heat and moisture sensitive substances in capsules, sachets, droplets and food compositions. It also relates to methods for encapsulating, to the encapsulated products and to methods for storing the encapsulated products. The invention is extremely suitable for the encapsulation of microbial cultures. Cultures encapsulated in capsules prepared according to the method of the invention, will stay stable for a long time. At 25 degrees C. they show a stability reduction of less than 1 log per month.

Abstract: A system for and method of processing, i.e., annealing semiconductor materials. By controlling the time, frequency, variance of frequency, microwave power density, wafer boundary conditions, ambient conditions, and temperatures (including ramp rates), it is possible to repair localized damage lattices of the crystalline structure of a semiconductor material that may occur during the ion implantation of impurities into the material, electrically activate the implanted dopant, and substantially minimize further diffusion of the dopant into the silicon. The wafer boundary conditions may be controlled by utilizing susceptor plates (4) or a water chill plate (12). Ambient conditions may be controlled by gas injection (10) within the microwave chamber (3).

Abstract: A mattress package with a full perimeter protection and handling piece combines a barrier layer which encapsulates a mattress with a perimeter piece attached about a perimeter of the mattress proximate to the border of the mattress and preferably extending over the adjacent major surfaces of the mattress over the barrier layer. The perimeter piece provides increased strength and protection to the package about the entire perimeter of the mattress, and provides a grip for handling of the mattress which evenly distributes stresses on the package to prevent breach or failure of the package. The perimeter piece can be positioned underneath or on top of a barrier layer.

Abstract: A method for the manufacture of carotenoid powders is disclosed. In the disclosed method, an aqueous suspension of the carotenoid is heated to melt the carotenoid, the suspension is then homogenized under pressure to form an emulsion, and the resulting emulsion is dried to obtain the carotenoid powder.

Abstract: A head-impact test device is used for crash-testing individual vehicle components, and includes a support structure with a pendulum member pivotally connected to the support structure. The pendulum member includes an end portion. A dummy headform is releasably connected to the end portion of the pendulum member, and includes a metal base portion. An electromagnet is disposed within the end portion of the pendulum member for selectively securing the metal base portion of the dummy headform to the end portion. A component stand is positioned adjacent the support structure for supporting a component to be tested. The electromagnet is operative to release the headform for impact against the component after the headform has been accelerated by the pendulum member.

Abstract: A projection lighting unit which includes a U-shaped bracket member having an apertured faceplate and a rear upstanding wall, a glass reflector secured to the bracket's faceplate portion and including a concave reflecting portion and a rear neck portion adjacent thereto and including a cylindrical opening therein, a capsule member removably positioned within the reflector's rear opening and including an incandescent projection lamp (e.g., tungsten-halogen) and a cylindrical, metallic base member secured to the sealed end of the lamp, and a biasing flange member including a pair of cam springs which slidably engage the upstanding rear wall of the bracket during rotational insertion of the lamp capsule within the unit's reflector. The unit thus provides for rear removal of the lamp capsule from the glass reflector and bracket components.