Abstract: Embodiments of the present disclosure generally relate fluid nozzles used in semiconductor manufacturing. The fluid nozzle includes a nozzle body disposed between an inlet face and an outlet face. The body includes a threaded region, a central symmetric axis, and a port. The threaded region is disposed between the inlet face and the outlet face. The central symmetric axis extends along a port axis and through the nozzle body. The port extends along a port axis and through the nozzle body. The port axis extends through the nozzle body between the inlet face and the outlet face. A first angle is formed between the port axis and the central symmetric axis. A port outlet face is perpendicular to the port axis, adjacent to the outlet face, and at a second angle to the outlet face.

Abstract: Temperature control of a process chamber 25 is achieved by directing a flow of gas at an external surface 100 of the chamber 25. In one aspect, gas directed at the chamber 25 passes through a gas flow amplifier 115 that increases the gas flow. Gas for the temperature control can be drawn in from the ambient air and, after passing over the process chamber 25, the gas can flow out through an outlet 150. Data is presented demonstrating superior temperature control performance over a conventional system.