Abstract: An apparatus and process for etching fluoroplastics is disclosed. A fluoroplastic film, sheet or tape is passed under an etchant distribution means comprised of an annularly shaped and hollow main body having a series of openings therethrough. Attached to the main body are a series of annularly shaped hollow extension legs in parallel alignment with one another and in communication with said openings in the main body. Etchant is fed into the main body and by action of gravity flows into and through the hollow channels of the extension legs, exiting at the base of the extension legs, and being distributed evenly onto the side of the fluoroplastic passing under the etching distribution means. The etching distribution means also includes first and second sponge means attached to the main body on opposite sides thereof.