Abstract: A protective helmet having a cover plate over a front vision area and a cover plate knock out assembly for moving the cover plate a predetermined distance away from the helmet so that a finger of a user can get behind the cover plate to enable its removal from the front vision area of the helmet. The cover plate knock out assembly comprises a step-shaped actuator element and a light blocking cover. The upper portion of the step-shaped actuator pushes the cover plate away from the helmet when the lower portion of the step-shaped actuator is pressed. The cover plate made of clear plastic includes a spring tendency when slightly compressed when attached to the helmet thereby pushing the upper portion of the step-shaped actuator into a resting position in the helmet.

Abstract: A protective helmet having a cover plate over a front vision area and a cover plate knock out assembly for moving the cover plate a predetermined distance away from the helmet so that a finger of a user can get behind the cover plate to enable its removal from the front vision area of the helmet. The cover plate knock out assembly comprises a step-shaped actuator element and a light blocking cover. The upper portion of the step-shaped actuator pushes the cover plate away from the helmet when the lower portion of the step-shaped actuator is pressed. The cover plate made of clear plastic includes a spring tendency when slightly compressed when attached to the helmet thereby pushing the upper portion of the step-shaped actuator into a resting position in the helmet.

Abstract: A protective helmet having a cover plate over a front vision area and a cover plate knock out assembly for moving the cover plate a predetermined distance away from the helmet so that a finger of a user can get behind the cover plate to enable its removal from the front vision area of the helmet. The cover plate knock out assembly comprises a step-shaped actuator element and a light blocking cover. The upper portion of the step-shaped actuator pushes the cover plate away from the helmet when the lower portion of the step-shaped actuator is pressed. The cover plate made of clear plastic includes a spring tendency when slightly compressed when attached to the helmet thereby pushing the upper portion of the step-shaped actuator into a resting position in the helmet.

Abstract: A protective helmet having a cover plate over a front vision area and a cover plate knock out assembly for moving the cover plate a predetermined distance away from the helmet so that a finger of a user can get behind the cover plate to enable its removal from the front vision area of the helmet. The cover plate knock out assembly comprises a step-shaped actuator element and a light blocking cover. The upper portion of the step-shaped actuator pushes the cover plate away from the helmet when the lower portion of the step-shaped actuator is pressed. The cover plate made of clear plastic includes a spring tendency when slightly compressed when attached to the helmet thereby pushing the upper portion of the step-shaped actuator into a resting position in the helmet.

Abstract: An underfill device and method have been are provided. Advantages of devices and methods shown include dissipation of stresses at an interface between components such as a chip package and an adjacent circuit board. Another advantage includes faster manufacturing time and ease of manufacture using underfill devices and methods shown. An underfill assembly can be pre made with conductive structures included within the underfill assembly. Steps such as flowing epoxy and curing can be eliminated or performed concurrently with other manufacturing steps.

Abstract: A protective helmet having a cover plate over a front vision area and a cover plate knock out assembly for moving the cover plate a predetermined distance away from the helmet so that a finger of a user can get behind the cover plate to enable its removal from the front vision area of the helmet. The cover plate knock out assembly comprises a step-shaped actuator element and a light blocking cover. The upper portion of the step-shaped actuator pushes the cover plate away from the helmet when the lower portion is pressed towards the cover plate. The cover plate is made of clear plastic and has a tendency, when slightly compressed and attached to the helmet, to push the upper portion of the step-shaped actuator into a resting position in the helmet.

Abstract: A protective helmet having a cover plate over a front vision area and a cover plate knock out assembly for moving the cover plate a predetermined distance away from the helmet so that a finger of a user can get behind the cover plate to enable its removal from the front vision area of the helmet. The cover plate knock out assembly comprises a slide/pushbutton element and a light blocking cover. The slide pushes the cover plate away from the helmet when the push button portion is pressed. The cover plate made of clear plastic comprises a spring tendency when slightly compressed when attached to the helmet thereby pushing the slide into a resting position in the helmet.

Abstract: An underfill device and method have been are provided. Advantages of devices and methods shown include dissipation of stresses at an interface between components such as a chip package and an adjacent circuit board. Another advantage includes faster manufacturing time and ease of manufacture using underfill devices and methods shown. An underfill assembly can be pre made with conductive structures included within the underfill assembly. Steps such as flowing epoxy and curing can be eliminated or performed concurrently with other manufacturing steps.

Abstract: An underfill device and method have been are provided. Advantages of devices and methods shown include dissipation of stresses at an interface between components such as a chip package and an adjacent circuit board. Another advantage includes faster manufacturing time and ease of manufacture using underfill devices and methods shown. An underfill assembly can be pre made with conductive structures included within the underfill assembly. Steps such as flowing epoxy and curing can be eliminated or performed concurrently with other manufacturing steps.

Abstract: A welding machine having a first receiver for remote control of the operating parameters, a viewing module having a second receiver for remotely controlling the operating parameters of the viewing module, and a control module for controlling the operating parameters of the welding machine and the viewing module wherein the control modules and the viewing modules may be mounted in a helmet. A master control module is provided for remotely controlling a plurality of control modules wherein each control module controls a viewing module. Each pair of control module and viewing ,module controlled by the master control module may be mounted in a helmet.

Abstract: A composition includes a solder paste matrix and a solder mixture including a tin-based solder alloy. The composition also includes a discrete dispersion of a metal. The tin-based alloy includes a melting first temperature and the metal includes a melting second temperature. The melting second temperature is greater than the melting first temperature. The discrete dispersion is in a particle range of a majority passing minus 520-mesh. A process includes blending the solder mixture and the metal under non-alloying conditions to achieve the discrete dispersion of the metal. A process includes reflowing the composition such that the composition when solidified, has a melting point that is higher than the solder mixture in the composition.

Abstract: Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.

Abstract: A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

Abstract: A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

Abstract: Electronic contacts, including spherical cores and attachment layers on the cores, are provided for attaching a semiconductor package substrate to a printed circuit board. The spherical cores are made of high-melting-temperature copper, and the attachment layers are made of a low-melting-temperature eutectic. The attachment layers melt in a reflow process. The spherical cores do not melt, and thereby control movement or “collapsing” of the package substrate toward the printed circuit board.

Abstract: Electronic contacts, including spherical cores and attachment layers on the cores, are provided for attaching a semiconductor package substrate to a printed circuit board. The spherical cores are made of high-melting-temperature copper, and the attachment layers are made of a low-melting-temperature eutectic. The attachment layers melt in a reflow process. The spherical cores do not melt, and thereby control movement or “collapsing” of the package substrate toward the printed circuit board.