Patents by Inventor Edward Laurent
Edward Laurent has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11947445Abstract: Systems and methods for adjusting operating parameters of at least one pipelined software asset. Within a pipelined environment, an agent software asset is inserted immediately preceding a software asset whose operating parameters are to be adjusted. The agent software asset receives data and/or data sets from a user and such data and data sets are inserted/used by the software asset. The agent software asset also allows for a reporting of the output of other software assets to thereby provide users with intermediate outputs from the pipelined environment.Type: GrantFiled: February 17, 2023Date of Patent: April 2, 2024Assignee: MCKINSEY & COMPANY, INC.Inventors: Pedro Miguel Vilhena da Maia de Sá E Menezes, Andreas Raggl, Ryan Edward Luque Maas, Andreas Kremer, Frank Rainer Alfons Herbert Gerhard, Pankaj Kumar, Marie-Paule Laurent, Michelle Atwood, Justin Lee Gibbs
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Patent number: 8004299Abstract: A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.Type: GrantFiled: March 1, 2011Date of Patent: August 23, 2011Assignee: SV Probe Pte. Ltd.Inventors: Scott R. Williams, Edward Laurent, David T. Beatson, Bahadir Tunaboylu, Edward L. Malantonio
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Publication number: 20110148449Abstract: A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.Type: ApplicationFiled: March 1, 2011Publication date: June 23, 2011Inventors: Scott R. Williams, Edward Laurent, David T. Beatson, Bahadir Tunaboylu, Edward L. Malantonio
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Patent number: 7393773Abstract: A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circuits. The bonding pads are formed by applying a plurality of bumps of electrically conductive material to a mounting surface of the substrate using a dispensing mechanism. The bumps are subsequently deformed into a plurality of substantially co-planar bonding pads using a flattening tool. The bonding pads provide a planar surface to which probes may be mounted, improving the accuracy and precision of positioning of tips of the probes.Type: GrantFiled: July 26, 2005Date of Patent: July 1, 2008Assignee: SV Probe Pte Ltd.Inventors: Edward L. Malantonio, Edward Laurent, Ilan Hanoon
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Publication number: 20070256299Abstract: An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments of the invention include attaching the cantilever probe to a carrier structure by clamping the cantilever probe to the carrier structure, bonding the cantilever probe to the carrier structure via a post feature on the cantilever probe, or applying a material on the carrier structure and substantially around and in contact with the cantilever probe to affix the cantilever probe to the carrier structure. A probe tip can then be formed on the cantilever probe while the cantilever probe is attached or affixed to the carrier structure. The cantilever probe can then be removed and bonded to a probe substrate.Type: ApplicationFiled: February 21, 2007Publication date: November 8, 2007Inventors: Dov Chartarifsky, Edward Laurent, Edward Malantonio, Richard Sadler, Bahadir Tunaboylu
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Publication number: 20070200576Abstract: A probe for a probe card assembly is provided. The probe has a post structure supported by a substrate, a plurality of stacked beam elements disposed on the post structure, and a tip attached to a surface of a top beam element, of the plurality of stacked beam elements, that opposes the substrate. The tip is configured to be electrically connected to a semiconductor device to be tested. The probe may be bent so that the tip is further away from the substrate than the height the post structure. The effective maximum force exerted by the tips of a multi-beamed probe against, for example, DUT pads may be increased when compared to prior probes.Type: ApplicationFiled: February 7, 2007Publication date: August 30, 2007Inventors: Edward Laurent, Edward Malantonio, Richard Sadler, Bahadir Tunaboylu, Brian McHugh, Dov Chartarifsky
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Publication number: 20070200577Abstract: A method and apparatus for repairing a probe on a probe card is provided. A plurality of beams is formed on a beam panel. The plurality of beams includes a replacement beam. After identifying a damaged beam on the probe card, the damaged beam is removed from the probe card. The beam panel is aligned with the probe card. After the beam panel is aligned, the aligned beam panel is temporarily affixed to the probe card. After the beam panel is temporarily affixed to the probe card, the replacement beam is affixed at a location previously occupied by the damaged beam. After the replacement beam is affixed at the location, the beam panel is removed from the probe card.Type: ApplicationFiled: February 7, 2007Publication date: August 30, 2007Inventors: Bahadir Tunaboylu, John McGlory, Horst Clauberg, Bruce Griffing, Robert Werner, Edward Laurent, Edward Malantonio, Alan Slopey, Paul Berenycky
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Publication number: 20070089551Abstract: A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.Type: ApplicationFiled: September 29, 2006Publication date: April 26, 2007Inventors: Scott Williams, Edward Laurent, David Beatson, Bahadir Tunaboylu, Edward Malantonio
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Patent number: 7173441Abstract: A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and separate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal.Type: GrantFiled: October 12, 2004Date of Patent: February 6, 2007Assignee: SV Probe Pte., Ltd.Inventors: January Kister, David Beatson, Edward Laurent
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Publication number: 20060065695Abstract: A wire feed system for a wire bonding apparatus is provided. The wire feed system includes a spool for storage of a wire, a wire tensioner, and a wire guide adapted to form the wire into a predetermined configuration between the spool and the wire tensioner. The wire tensioner and the wire guide are supported such that relative movement between the wire tensioner and the wire guide during a wire bonding procedure is substantially prevented.Type: ApplicationFiled: September 26, 2005Publication date: March 30, 2006Inventor: Edward Laurent
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Publication number: 20060028220Abstract: A probe card assembly is provided. The probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the substrate. The reinforcing layer is in contact with a lower portion of each of the probes, where a remaining portion of each of the probes is free from the reinforcing layer.Type: ApplicationFiled: July 19, 2005Publication date: February 9, 2006Inventors: Edward Malantonio, Edward Laurent, Ilan Hanoon, Andrew Hmiel, Bahadir Tunaboylu, Anh-Tai Nguyen, Lich Tran
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Publication number: 20060022690Abstract: A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circuits. The bonding pads are formed by applying a plurality of bumps of electrically conductive material to a mounting surface of the substrate using a dispensing mechanism. The bumps are subsequently deformed into a plurality of substantially co-planar bonding pads using a flattening tool. The bonding pads provide a planar surface to which probes may be mounted, improving the accuracy and precision of positioning of tips of the probes.Type: ApplicationFiled: July 26, 2005Publication date: February 2, 2006Applicant: K&S Interconnect, Inc.Inventors: Edward Malantonio, Edward Laurent, Ilan Hanoon
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Patent number: 6965245Abstract: A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and seperate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal.Type: GrantFiled: May 1, 2003Date of Patent: November 15, 2005Assignee: K&S Interconnect, Inc.Inventors: January Kister, David Beatson, Edward Laurent
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Publication number: 20050247755Abstract: A tool for attaching fine preformed probes to a substrate for use with a vacuum source is disclosed. The apparatus comprises a body portion; a tip portion disposed at one end of the body portion; a first orifice extending from a first end of the body portion to the working tip; and at least one second orifice extending from an outer portion of the working tip and communicating with the first orifice, wherein the vacuum source is coupled to the body portion so that a vacuum generated by the vacuum source is provided to the at least one second orifice.Type: ApplicationFiled: July 27, 2004Publication date: November 10, 2005Inventors: Edward Laurent, Dan Mironescu
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Publication number: 20050052194Abstract: A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and separate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal.Type: ApplicationFiled: October 12, 2004Publication date: March 10, 2005Inventors: January Kister, David Beatson, Edward Laurent
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Publication number: 20040217768Abstract: A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and seperate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal.Type: ApplicationFiled: May 1, 2003Publication date: November 4, 2004Inventors: January Kister, David Beatson, Edward Laurent
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Patent number: 6319545Abstract: A method of constructing a resilient surface layer of particles bound together and to a base surface comprises uniformly dropping dry rubber particles from a moving apparatus and spraying the particles with a liquid, water based, latex binder as the particles are dropping, the apparatus comprises a movable vehicle with a particulate spreading assembly comprising a hopper with a controlled orifice, and a spray system with an array of nozzles directed to intersect the path of the particles after leaving the hopper and before the particles reach the base surface.Type: GrantFiled: February 15, 2000Date of Patent: November 20, 2001Inventor: Lance Edward Laurent
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Patent number: 5806542Abstract: A washing apparatus designed particularly for road transport vehicles comprises a washing station with a pair of longitudinal rails carrying a carriage for movement along the vehicle. The carriage carries a pair of depending side arms with spray nozzles on the inside surface for spraying the sides of the vehicle. A horizontal beam is supported on a pair of lift carriages to move vertically and can rotate about a transverse axis to point forwardly, downwardly or rearwardly. The horizontal beam carries spray nozzles. The system uses sensors carried on the carriage to detect the position of the vehicle and to generate a stored matrix defining the shape. A control unit in response to the matrix moves the carriage and vertically movable element to the required position to spray the front, top and rear of the vehicle.Type: GrantFiled: September 3, 1996Date of Patent: September 15, 1998Assignees: Michael I. Hoffer, R. Guy GirardinInventors: Michael I. Hoffer, R. Guy Girardin, Brian Keith Chorney, Edward Laurent Fleury, J. Desmond Bean