Patents by Inventor Edward Leal Hadden

Edward Leal Hadden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4005921
    Abstract: An electrical connector for a flat multi-conductor transmission cable includes a cable terminating face, a parapet having a plurality of V-shaped grooves and a scalloped top extending from the face, a bus strip engageable with the face, and a cover. Also, a method for terminating the cable includes severing an insulated sheath of the cable intermediate its end, sliding the severed insulated end along a length of the conductors to expose the shield and signal conductors, severing the signal conductors, folding the insulated end of the transmission cable back along its length over a bus strip, and engaging the shield conductors with the bus and the signal conductors with electrical terminals on the face of the connector.
    Type: Grant
    Filed: February 23, 1976
    Date of Patent: February 1, 1977
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Edward Leal Hadden, Robert Franklin Evans
  • Patent number: 3993384
    Abstract: A connector block for forming interconnections between contact pads on a flat leadless IC package and corresponding pads on a parallel circuit board. The block carries a number of terminals each having a collapsible linkage such that when the package is moved toward the circuit board, collapse of the linkage is controlled by a guide surface and wiped pressure connections are formed between the terminals and pads on both the substrate and the circuit board.
    Type: Grant
    Filed: May 12, 1975
    Date of Patent: November 23, 1976
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Richard Kay Dennis, Edward Leal Hadden
  • Patent number: 3982159
    Abstract: A retaining frame for forming interconnections between contact pads on a flat leadless I.C. package and corresponding pads on a parallel mother board so that when the package is moved toward the mother board and into the frame, contacts in the frame are compressed and contact surfaces are biased toward and moved along the contact pads on the package and board to form positive wiped electrical connections.
    Type: Grant
    Filed: November 11, 1974
    Date of Patent: September 21, 1976
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Richard Kay Dennis, Edward Leal Hadden