Abstract: A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such process and resultant circuit effectively address the electrical shorting problems caused by nonremoval of the residual catalyst material and circuit material which has seeped under the residual catalyst material. The process includes the steps of: a) providing a catalyst layer (e.g., palladium and tin) having circuit pattern (e.g., copper) thereon; b) pretreating the catalyst layer and the circuit pattern (e.g., with a cyanide dip) for removal of undesirable portions of each which cause electrical leakage between circuit lines of the circuit pattern; c) oxidizing the catalyst layer and the circuit pattern (e.g.

Abstract: A compact tension testing apparatus for determining the peel strength of a circuit line or film bonded to a substrate. A force gauge is mounted on an apparatus using low friction air bearings to allow the force gauge to self-align with the peeling location of the circuit line or film, thereby providing essentially orthogonal positioning relative to the substrate.

Abstract: A compact tension testing apparatus for determining the peel strength of a circuit line or film bonded to a substrate. A force gauge is mounted on an apparatus using low friction air bearings to allow the force gauge to self-align with the peeling location of the circuit line or film, thereby providing essentially orthogonal positioning relative to the substrate.

Abstract: A compact tension testing apparatus for determining the peel strength of a circuit line or film bonded to a substrate. A force gauge is mounted on an apparatus using low friction air bearings to allow the force gauge to self-align with the peeling location of the circuit line or film, thereby providing essentially orthogonal positioning relative to the substrate.

Abstract: A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such process and resultant circuit effectively address the electrical shorting problems caused by nonremoval of the residual catalyst material and circuit material which has seeped under the residual catalyst material. The process includes the steps of: a) providing a catalyst layer (e.g., palladium and tin) having circuit pattern (e.g., copper) thereon; b) pretreating the catalyst layer and the circuit pattern (e.g., with a cyanide dip) for removal of undesirable portions of each which cause electrical leakage between circuit lines of the circuit pattern; c) oxidizing the catalyst layer and the circuit pattern (e.g.