Abstract: A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit chip, whose surface has corresponding etch pit wells that mate with the etch pit wells of the first integrated circuit chip. Spherical balls are placed in the etch pit wells of the first integrated circuit chip such that when the corresponding etch pit wells of the second integrated circuit chip are substantially aligned with the spherical balls, the spherical balls mate with the etch well pits of the second integrated circuit chip, thereby precisely aligning the first integrated circuit chip with the second integrated circuit chip.

Abstract: A mechanism is disclosed for cooling electronic components of a module housed in a chassis. The chassis may be, for example, a rack or other housing, which may contain many such modules. The system comprises an external cooling system, and an internal cooling system for cooling electronic components on the module. The internal cooling system may reside on the module. The internal cooling system can be removed from the chassis to enable servicing components on the module without disconnecting any lines carrying cooling fluid in either fluid cooling system.