Abstract: A system comprises an optical fiber, a manipulator assembly, and a control unit. The manipulator assembly comprises a chassis, an optical fiber cleaning assembly housed within the chassis, and a drive mechanism housed within the chassis. The optical fiber cleaning assembly comprises a cleaning tape, a first spool on which the cleaning tape is wound, and a second spool onto which the cleaning tape is drawn after use. The drive mechanism is configured to advance the cleaning tape from the first spool to the second spool such that a portion of the cleaning tape wipes a face of the optical fiber. The control unit is configured to control the drive mechanism to advance the cleaning tape.

Abstract: A semiconductor package includes a die having a first surface including a plurality of bond pads disposed thereon and a second surface. Inner lead portions of a TAB leadframe are coupled to the bond pads and outer lead portions electrically coupled to the inner lead portions extend therefrom. An encapsulation is disposed on the first surface of the die including the bond pads having the inner lead portions of the TAB leadframe bonded thereto. Encapsulation is also disposed about the sides of the die. The second surface of the die remains exposed. This allows for a relatively thin package having superior thermal dissipation properties.

Abstract: An apparatus and method of forming aluminum balls utilized for ball bonding. The aluminum balls are formed in a moist argon atmosphere by applying an electrical potential across a spark gap causing a spark to occur which causes the end of the aluminum wire to melt, forming an aluminum ball.