Abstract: A method for making a vertically aligned carbon nanotube (VACNT) nanocomposite applique includes: growing a VACNT array on a substrate; treating the VACNT array with a polymer solution; performing one or more of curing and drying the polymer; and etching a surface of the polymer-VACNT nanocomposite to remove some of the polymer and to expose a portion of the VACNT. A vertically aligned carbon nanotube (VACNT) nanocomposite applique includes: a VACNT array; and a polymer solution with which the VACNT array is treated, wherein a surface of the polymer-VACNT nanocomposite is etched so as to do one or more of removing some of the polymer and exposing a portion of the VACNT.

Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. At least one of the interfacial layers is a vertically aligned metal nanowire array. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.

Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.

Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.

Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.

Abstract: A method for making a thermal interface material (TIM) comprises the steps of: depositing a seed layer onto a substrate; attaching a template membrane to the substrate; depositing metal into one or more of the pores of the template membrane, substantially filling the template membrane to create a vertically-aligned metal nanowire (MNW) array comprising a plurality of nanowires that grow upward from the seed layer; and after the template membrane is substantially filled with the deposited metal, removing the template membrane, leaving the plurality of nanowires attached to the seed layer. A TIM comprises: a vertically-aligned MNW array comprising a plurality of nanowires that grow upward from a seed layer deposited on the surface of a template membrane, and the template membrane being removed after MNW growth.

Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.

Abstract: A polymer composite material that achieves an improved damage resistant performance reinforced composite by adding carbon nanotubes (CNTs) is disclosed. The CNTs serve as the mechanical strengthening component. Higher filler loadings and filler surface area proved by CNTs result in volume maximization which provides a more homogeneous distribution of fillers. This allows the formation of a network of nanofibers which reduces the filler-free volume of the matrix, effectively filling nano-sized voids.

Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.

Abstract: A method includes the steps of receiving a conductor element formed from a plurality of carbon nanotubes; and exposing the conductor element to a controlled amount of a dopant so as to increase the conductance of the conductor element to a desired value, wherein the dopant is one of bromine, iodine, chloroauric acid, hydrochloric acid, hydroiodic acid, nitric acid, and potassium tetrabromoaurate. A method includes the steps of receiving a conductor element formed from a plurality of carbon nanotubes; and exposing the conductor element to a controlled amount of a dopant solution comprising one of chloroauric acid, hydrochloric acid, nitric acid, and potassium tetrabromoaurate, so as to increase the conductance of the conductor element to a desired value.

Abstract: A cable comprising hybrid carbon nanotube (CNT) shielding includes at least one conducting wire; at least one insulating layer covering at least one of the at least one conducting wire; a metallic foil component configured for lower frequency shielding function; and a CNT tape component configured for higher frequency shielding function.

Abstract: A method includes the steps of receiving a conductor element formed from a plurality of carbon nanotubes; and exposing the conductor element to a controlled amount of a dopant so as to increase the conductance of the conductor element to a desired value, wherein the dopant is one of bromine, iodine, chloroauric acid, hydrochloric acid, hydroiodic acid, nitric acid, and potassium tetrabromoaurate. A method includes the steps of receiving a conductor element formed from a plurality of carbon nanotubes; and exposing the conductor element to a controlled amount of a dopant solution comprising one of chloroauric acid, hydrochloric acid, nitric acid, and potassium tetrabromoaurate, so as to increase the conductance of the conductor element to a desired value.

Abstract: The invention relates to high stiffness parabolic structures utilizing integral reinforced grids. The parabolic structures implement the use of isogrid structures which incorporate unique and efficient orthotropic patterns for efficient stiffness and structural stability.