Patents by Inventor Edward M. Wolf

Edward M. Wolf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package with overlapping bond fingers
    Patent number: 6956286
    Abstract: An integrated circuit package comprises a set of bond fingers for connecting wire bonds from the chip, the bond fingers being placed overlapping on a transverse axis from the chip and extending inwardly and outwardly from vias positioned at different positions along the transverse axis, so that wire bonds connected to adjacent fingers have the same length.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: October 18, 2005
    Assignee: International Business Machines Corporation
    Inventors: Mark J. Kuzawinski, Edward M. Wolf
  • Plating tail design for IC packages
    Patent number: 6908855
    Abstract: A plating tail connected to a signal trace for use during an electroplating operation is fabricated such that it has a substantially different impedance from the signal trace at a characteristic frequency in use, so that adverse reflections during operation are reduced below a threshold of significance.
    Type: Grant
    Filed: October 19, 2004
    Date of Patent: June 21, 2005
    Assignee: International Business Machines Corporation
    Inventors: Mark J. Kuzawinski, Edward M. Wolf
  • Plating tail design for IC packages
    Patent number: 6882038
    Abstract: A plating tail connected to a signal trace for use during an electroplating operation is fabricated such that it has a substantially different impedance from the signal trace at a characteristic frequency in use, so that adverse reflections during operation are reduced below a threshold of significance.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: April 19, 2005
    Assignee: International Business Machines Corporation
    Inventors: Mark J. Kuzawinski, Edward M. Wolf
  • Plating tail design for IC packages
    Publication number: 20040104464
    Abstract: A plating tail connected to a signal trace for use during an electroplating operation is fabricated such that it has a substantially different impedance from the signal trace at a characteristic frequency in use, so that adverse reflections during operation are reduced below a threshold of significance.
    Type: Application
    Filed: September 24, 2002
    Publication date: June 3, 2004
    Applicant: International Business Machines Corporation
    Inventors: Mark J. Kuzawinski, Edward M. Wolf