Abstract: High purity epoxide compounds methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.

Abstract: A hardener composition for epoxy resins includes a dianhydride and one or both of a monoanhydride and a hydroxyl-diterminated poly(phenylene ether). The hardener components can be blended in the substantial absence of solvent to yield a homogeneous composition having a reduced glass transition temperature or melting point that facilitates reduced-temperature blending of the hardener composition with the epoxy resin.

Abstract: A solid epoxy composition comprising: a high heat epoxy compound of one or more of formulas (I) to (IX) provided herein; and an amorphous epoxy compound, wherein the solid epoxy composition has a single glass transition temperature from 35° C. to 100° C., preferably from 40° C. to 95° C., wherein the solid epoxy composition exhibits no other glass transition temperature or crystalline melting point from ?20° C. to 200° C., and wherein R1, R2, Ra, Rb, R13, R14, p, q, c, and t are as provided herein.

Abstract: A high heat epoxy composition comprising: a high heat epoxy compound; a thermoplastic polymer; and a hardener; wherein a cured sample of the high heat epoxy composition has a glass transition temperature greater than or equal to 200° C., preferably greater than 220° C., or preferably greater than 240° C., measured as per ASTM D3418; or wherein a cured sample of the composition has a fracture toughness greater than 150 J/m2, preferably greater than 170 J/m2, preferably greater than 190 J/m2, measured as per ASTM D5045 is provided.

Abstract: A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.

Abstract: High purity epoxide compounds methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.

Abstract: High heat monomer compounds, methods for preparing compounds, and compositions derived from the compounds are provided. Also provided are materials and articles derived from the compounds.

Abstract: High purity epoxide compounds, methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.

Abstract: A process for preparing a diglycidyl ether of formula (1) to (9) with epichlorohydrin and a catalyst, for a time and at a temperature to provide a first reaction mixture comprising a dichlorohydrin of formula (1-d) to (9-d); adding a base to the first reaction mixture to provide a second reaction mixture over a period of 15 minutes to 3 hours; and agitating the second reaction mixture for 2 to 5 hours at 40 to 60° C., to provide an as-synthesized diglycidyl ether of formula (1) to (9) having a purity of 96 to 99% or greater as determined by high performance liquid chromatography is provided. An as-synthesized or isolated diglycidyl ether of formula (1) to (9) made by the provided process is provided. A cured composition comprising the cured product of the provided diglycidyl ether, and an article comprising the same are provided.

Abstract: High heat monomer compounds, methods for preparing compounds, and compositions derived from the compounds are provided. Also provided are materials and articles derived from the compounds.

Abstract: A high heat epoxy composite including a substrate; a matrix composition comprising: a high heat epoxy compound, and a hardener, wherein the matrix composition comprises 20 to 40 total weight percent of the composite; and wherein a cured sample of the matrix composition has a glass transition temperature of greater than or equal to 200 C; and a cured, laminated sample of the composite has a flexural strength of greater than 850 MPa measured as per ASTM D7264; and a flexural modulus of greater than 65 GPa measured as per ASTM D7264 is provided.

Abstract: A high heat epoxy prepreg, comprising a substrate; a high heat epoxy composition comprising: a hardener; a high heat epoxy mixture comprising: a high heat epoxy compound and an auxiliary epoxy compound different from the high heat epoxy compound; wherein the high heat epoxy mixture has a glass transition temperature between ?10 C and 62 C, wherein the prepreg comprises 40 to 80 volume % substrate, and 60 to 20 volume % of the high heat epoxy composition, wherein the prepreg comprises 12 to 45 volume % of the high heat epoxy compound; wherein the high heat epoxy composition comprises 50 to 75 wt % of the high heat epoxy compound; and a cured, laminated sample of the prepreg has a maximum tensile stress of 800 MPa or greater, measured as per ASTM D 3039, and a modulus of 70 GPa or greater measured as per ASTM D 3039; and a cured sample of the high heat epoxy composition has a glass transition temperature greater than 200 C.

Abstract: A hardener composition is prepared by blending a low intrinsic viscosity hydroxyl-diterminated poly(phenylene ether), and an anhydride having structure (1) where q, Ra, and X are defined herein. The hardener composition exhibits glass transition temperature of ?46 to +110° C., which is characteristic of the blend and distinct from the glass transition temperatures of the individual components. Also described are a method of forming the hardener composition, a curable epoxy composition incorporating the hardener composition, a cured composition formed from the curable epoxy composition, and an article that includes the cured composition.

Abstract: A method of forming a cured epoxy material includes pre-reacting a phenylene ether oligomer with an anhydride hardener before adding an epoxy resin and a curing promoter, then curing the resulting composition. The method provides an improved balance of heat resistance and toughness relative to corresponding methods in which the phenylene ether oligomer is pre-reacted with the epoxy resin prior to addition of hardener, and in which all components are mixed simultaneously. The cured epoxy material can be used in the composite core of an aluminum conductor composite core reinforced cable.

Abstract: A copolymer exhibiting improved heat resistance relative to phenolic resins is formed by the reaction of a bisphenol diglycidyl ether and a phenolphthalein and/or a phenolphthalimidine in a molar ratio of 0.98:1 to 1.02:1 in the presence of a catalyst. The copolymer can be used to mold plastic parts. The copolymer is also useful as a flexibilizer in thermoset compositions, and useful as a compatibilizer in blends of polar and non-polar polymers, and blends of non-polar polymers and polar fillers.

Abstract: A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.

Abstract: High heat monomer compounds, methods for preparing compounds, and compositions derived from the compounds are provided. Also provided are materials and articles derived from the compounds.

Abstract: High purity epoxide compounds methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.

Abstract: Disclosed are compositions comprising: (a) 10 to 40 percent by weight of the ultrafine particulate poly(phenylene ether), wherein the mean particle size of the poly(phenylene ether) is 9 microns or less; (b) 60 to 90 percent by weight of an epoxy resin; wherein the weight percents are based on the total weight of the composition. Also disclosed are processes for preparing such compositions as well as articles derived therefrom.

Abstract: A rigid polyurethane or polyisocyanurate foam includes 1 to 50 weight percent of a particulate poly(phenylene ether) having a mean particle size of 1 to 40 micrometers. The particulate poly(phenylene ether) imparts reduced flammability and reduced water absorption to the foam. The foam is useful as a thermally insulating material in articles including domestic appliances, building materials, tanks, pipelines, heating pipes, cooling pipes, cold stores, and refrigerated vehicles.