Abstract: An aligning and positioning system for a bonder including a bond sensor for sensing the X, Y and .theta. coordinates of a substrate at the bonding location and a die sensor for sensing the X, Y and .theta. coordinates of the die on a die transport. A controller correlates the sensed coordinates from the sensors and adjusts the X, Y and .theta. of the die and the substrate relative to each other to place the die at a preselected bond site on the substrate. The Z coordinate of the surface of the substrate, as well as its planarity, may be sensed by a Z optical sensor. The X and Y coordinates of the substrate are adjusted and the .theta. coordinate of the die on the die transport is adjusted.A pattern recognition system is used with the die and bond sensors to determine the coordinates as well as quality control of the substrate prior to bonding, the quality of paste pattern on the die or the substrate prior to bonding and the quality of the bond and the coordinates of the die after bonding.