Abstract: A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.

Abstract: A cooling system is provided for controlling temperature in a power electronic device. The power electronic device includes a semiconductor having a major surface. The cooling system includes a temperature sensor coupled to the major surface of the semiconductor; and a control circuit coupled the temperature sensor. The control circuit is configured to reduce current to the inverter circuit when the temperature exceeds a predetermined temperature.

Abstract: A terminal assembly for a power converter is provided. The terminal assembly includes first and second conductive components and a current sensor. The first conductive component has first and second releasable attachment formations. The second conductive component has first and second portions with respective first and second widths. The first width is less than the second width. The first portion is releasably attached to the first conductive component with the second releasable attachment formation. The current sensor has an opening therethrough and is positioned between the first conductive component and the second portion of the second conductive component such that the first portion of the first conductive component extends through the opening. The current sensor is responsive to current flowing through the first portion of the second conductive component.

Abstract: A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.

Abstract: A semiconductor device is provided, and includes a wafer having first and second opposed metallized major faces and a transistor bonded to the first metallized face of the wafer. The transistor includes a first surface, and the first surface defines a first area. The device further includes a first metal layer bonded to the first surface of the transistor. The first metal layer has a first surface that defines a second area larger than the first area of the transistor. The device further includes a ceramic layer bonded to the first surface of the first metal layer.

Abstract: A semiconductor subassembly is provided for use in a switching module of an inverter circuit for a high power, alternating current motor application. The semiconductor subassembly includes a wafer having first and second opposed metallized faces; a semiconductor switching device electrically coupled to the first metallized face of the wafer and having at least one electrode region; and an interconnect bonded to the semiconductor switching device. The interconnect includes a first metal layer bonded to the at least one electrode region of the semiconductor switching device, a ceramic layer bonded to the first metal layer, the ceramic layer defining a via for accessing the first metal layer, a second metal layer bonded to the ceramic layer, and a conducting substance disposed in the via of the ceramic layer to electrically couple the first metal layer to the second metal layer.

Abstract: A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.