Patents by Inventor Edward Pena

Edward Pena has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of wire bonding a semiconductor die and apparatus therefor
    Patent number: 4583676
    Abstract: A semiconductor die surface heater and a method of using the die surface heater as a wire bonding assembly are provided. In the preferred form, the semiconductor die surface heater comprises two heaters. A preheater heats the surface of a semiconductor die which is attached to a lead frame via radiant energy. A clamp which positions both the semiconductor die and lead frame during the wire bonding has a window portion with a surface clamp heater for heating at least the portion of the clamp around the window.
    Type: Grant
    Filed: May 3, 1982
    Date of Patent: April 22, 1986
    Assignee: Motorola, Inc.
    Inventors: Edward Pena, S. L. Cheong