Abstract: A microcircuit package with an integrated acoustic isolator made up of a stacked acoustic filter. The package includes a rigid, electrically conductive housing with a IC module mounted therein. The acoustic filter includes two electroacoustic transducers mounted on opposite sides of a common wall of the package, one inside the package and the other outside. An a.c. power source is connected to the transducer that is mounted on the outside of the package. Electrical energy from the power source is converted by the outside transducer into acoustic energy which is conducted through the package wall to the inside transducer which reconverts the acoustic energy into electrical energy. The package wall has a significant thickness in comparison to the acoustic wavelength of the filter passband and is preferably equal to an integer number of one-half acoustic wavelengths.